MC9S08JS8LCWJ Freescale Semiconductor, MC9S08JS8LCWJ Datasheet - Page 21
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MC9S08JS8LCWJ
Manufacturer Part Number
MC9S08JS8LCWJ
Description
MCU 8BIT 8K FLASH 20-SOIC
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.DEMO9S08JS16.pdf
(32 pages)
Specifications of MC9S08JS8LCWJ
Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
LIN, SCI, SPI, USB
Peripherals
LVD, POR, PWM
Number Of I /o
14
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
512 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
S08JS
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
512 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
48 MHz
Number Of Timers
1
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08JS16
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Data Converters
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08JS8LCWJ
Manufacturer:
Freescale Semiconductor
Quantity:
135
3.10
Table 11
Freescale Semiconductor
and
SPI Characteristics
Figure 18
through
TPMxCHn
TPMxCHn
Figure 21
MC9S08JS16 Series MCU Data Sheet, Rev. 4
Figure 17. Timer Input Capture Pulse
describe the timing requirements for the SPI system.
t
t
ICPW
ICPW
Electrical Characteristics
21