MC9S08SH16CTGR Freescale Semiconductor, MC9S08SH16CTGR Datasheet - Page 181
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MC9S08SH16CTGR
Manufacturer Part Number
MC9S08SH16CTGR
Description
MCU 8BIT 16K FLASH 16-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.MC9S08SH16CTG.pdf
(328 pages)
Specifications of MC9S08SH16CTGR
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
13
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
16-TSSOP
Package
16TSSOP
Family Name
HCS08
Maximum Speed
40 MHz
Operating Supply Voltage
3.3|5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
13
Interface Type
SCI/SPI
On-chip Adc
8-chx10-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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If EREFSTEN is set and the ERCLKEN bit is written to 1, the external reference clock will keep running
during stop mode in order to provide a fast recovery upon exiting stop.
11.4.7
The ICS presents the divided FLL reference clock as ICSFFCLK for use as an additional clock source for
peripheral modules. The ICS provides an output signal (ICSFFE) which indicates when the ICS is
providing ICSOUT frequencies four times or greater than the divided FLL reference clock (ICSFFCLK).
In FLL Engaged mode (FEI and FEE) this is always true and ICSFFE is always high. In ICS Bypass
modes, ICSFFE will get asserted for the following combinations of BDIV and RDIV values:
Freescale Semiconductor
Fixed Frequency Clock
•
•
•
•
BDIV=00 (divide by 1), RDIV ≥ 010
BDIV=01 (divide by 2), RDIV ≥ 011
BDIV=10 (divide by 4), RDIV ≥ 100
BDIV=11 (divide by 8), RDIV ≥ 101
MC9S08SH32 Series Data Sheet, Rev. 2
PRELIMINARY
Chapter 11 Internal Clock Source (S08ICSV2)
181
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