MC9S08SH16CTL Freescale Semiconductor, MC9S08SH16CTL Datasheet - Page 291
MC9S08SH16CTL
Manufacturer Part Number
MC9S08SH16CTL
Description
MCU 8BIT 16K FLASH 28-TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08SH16CTL
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
23
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-TSSOP
Processor Series
S08SH
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
23
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO, DEMO9S08SH32, DEMO9S08SH8
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
Package
28TSSOP
Family Name
HCS08
Maximum Speed
40 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08SH16CTL
Manufacturer:
Freescale Semiconductor
Quantity:
135
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A.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits, and it is user-determined rather than being controlled by the
MCU design. To take P
voltage and V
pin current (heavy loads), the difference between pin voltage and V
Freescale Semiconductor
1
2
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board,
and board thermal resistance.
Junction to Ambient Natural Convection
Num
Thermal Characteristics
1
2
3
4
SS
or V
—
D
D
C
DD
I/O
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
and multiply by the pin current for each I/O pin. Except in cases of unusually high
into account in power calculations, determine the difference between actual pin
Single-layer board
Four-layer board
8-pin NB SOIC
16-pin TSSOP
20-pin PDIP
20-pin TSSOP
24-pin QFN
8-pin NB SOIC
16-pin TSSOP
20-pin PDIP
20-pin TSSOP
24-pin QFN
MC9S08SH8 MCU Series Data Sheet, Rev. 3
Table A-3. Thermal Characteristics
Rating
1,2
1,2
M
C
Symbol
θ
θ
T
T
JA
JA
A
J
SS
or V
DD
Appendix A Electrical Characteristics
–40 to 125
–40 to 85
T
will be very small.
L
Value
135
167
123
115
110
115
68
75
49
76
42
to T
H
°C/W
°C/W
Unit
°C
°C
291
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