S9S08SG16E1CTLR Freescale Semiconductor, S9S08SG16E1CTLR Datasheet - Page 6
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S9S08SG16E1CTLR
Manufacturer Part Number
S9S08SG16E1CTLR
Description
IC MCU 8BIT 16KB FLASH 28TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.S9S08SG16E1CTG.pdf
(330 pages)
Specifications of S9S08SG16E1CTLR
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
28-TSSOP
Processor Series
S08SG
Core
HCS08
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08SG32, DEMO9S08SG32AUTO, DEMO9S08SG8, DEMO9S08SG8AUTO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
S9S08SG16E1CTLRTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Revision History
To provide the most up-to-date information, the revision of our documents on the World Wide Web will be
the most current. Your printed copy may be an earlier revision. To verify you have the latest information
available, refer to:
The following revision history table summarizes changes contained in this document.
6
Revision
http://freescale.com/
Number
1
2
3
4
5
6
7
Revision
10/2007
03/2009
04/2009
10/2009
6/2007
5/2008
5/2008
Date
Updated the TPM module, incorporated minor revisions for the T
rate, FPROT and Appendix B packaging information. -SAMPLES DRAFT-
Qualify Draft includes updates to TPM module and the Electricals appendix.
Also, revised the order numbering information.
Updated some electricals and made some minor grammatical/formatting revi-
sions. Corrected the SPI block module version. Removed incorrect ADC temper-
ature sensor value from the Features section. Updated the package information
with a special mask set identifier.
Added the EMC Radiated Emissions data. Removed the Susceptibility Data.
Updated the Corporate addresses on the back cover.
Added the High Temperature Device Specifications and updated the charts.
Updated ADC characteristics for Temp Sensor Slope to be a range of
25 C–150 C , added Control Timing table row 2 to separate standard characteris-
tics from the AEC Grade 0 characteristics, and included the text, “AEC Grade 0”
to the text of footnote 3 for Table B-1 Device Numbering System. Added notes to
the ADC chapter specifying that, for this device, there are only 16 analog input
pins and consequently no APCTL3 register. Updated the Literature Request
information on the back cover.
Revised Table A-6 DC Characteristics, Row 24 Bandgap Voltage Reference for
AEC Grade 0 from 1.21V to 1.22 V. Removed AEC Grade 0 (red diamond) from
the Table A-9 ICS Frequency Specifications, Row 9 Total deviation of trimmed
DCO output frequency over voltage and temperature so that it is not listed for
AEC Grade 0.
MC9S08SG32 Data Sheet, Rev. 8
Description of Changes
Freescale Semiconductor
j
, PTxSE slew
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