MC9S08RG32FGE Freescale Semiconductor, MC9S08RG32FGE Datasheet - Page 219

• Manufacturer Part Number: MC9S08RG32FGE
• Description: IC MCU 32K FLASH 8MHZ 44-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08RG32FGE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 44-LQFP
• Processor Series: S08RG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 39
• Number Of Timers: 2
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08RG60E
• Minimum Operating Temperature: 0 C
• Controller Family/series: HCS08
• No. Of I/o's: 39
• Ram Memory Size: 2KB
• Cpu Speed: 8MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A
Appendix B
Ordering Information and Mechanical Drawings
B.1
This section contains generic ordering information for MC9S08RD/RE/RG devices and an example of the
device numbering system.
See
B.2
The following pages are mechanical drawings for these packages:
Freescale Semiconductor
•
•
•
•
•
Table B-1
28-Pin PDIP
28-Pin SOIC
32-Pin LQFP
44-Pin LQFP
48-Pin QFN
Ordering Information
Mechanical Drawings
Pin Count
Memory type (9 = FLASH)
28
28
32
44
48
for package availability for each MC9S08RD/RE/RG device.
Plastic Dual In-Line Package
Small Outline Integrated Circuit
Low Quad Flat Package
Low Quad Flat Package
Quad Flat Package
Derivative
Status
Core
MC9S08RC/RD/RE/RG Data Sheet, Rev. 1.11
Type
Table B-1. Package Descriptions
MC 9 S08 RG60 C XX E
Abbreviation
LQFP
LQFP
PDIP
SOIC
QFN
Indicates RoHS-compliant packaging
Package designator
Temperature range
designator
Designator
C = –40 thru 85°C
Blank = 0 thru 70°C
DW
FG
FD
FJ
P
Document No.
98ARH99048A
98ASB42390B
98ASB42345B
98ASH70029A
98ASB42885B
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