MC908AP32ACFAE Freescale Semiconductor, MC908AP32ACFAE Datasheet - Page 312

• Manufacturer Part Number: MC908AP32ACFAE
• Description: IC MCU 32K FLASH 8MHZ 48-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908AP32ACFAE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: I²C, IRSCI, SCI, SPI
• Peripherals: LED, LVD, POR, PWM
• Number Of I /o: 32
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LQFP
• Processor Series: HC08AP
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 2 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, DEMO908AP64E, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
23.4 42-Pin Shrink Dual In-Line Package (SDIP)
312
SEATING
PLANE
–T–
42
1
D
F
0.25 (0.010)
42 PL
–A–
M
T
G
A
Figure 23-3. 42-Pin SDIP (Case #858)
S
MC68HC908AP A-Family Data Sheet, Rev. 3
22
21
N
C
K
–B–
J
42 PL
0.25 (0.010)
M
H
T
L
B
M
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
Y14.5M, 1982.
FORMED PARALLEL.
FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
A
B
C
D
G
H
K
M
N
F
J
L
1.435
0.540
0.155
0.014
0.032
0.008
0.020
0.115
MIN
0.070 BSC
0.300 BSC
0.600 BSC
0°
INCHES
Freescale Semiconductor
MAX
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
15°
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
0.81
0.20
2.92
0.51
1.778 BSC
15.24 BSC
7.62 BSC
0°
37.21
14.22
MAX
5.08
0.56
1.17
0.38
3.43
15°
1.02