MCF5329CVM240J Freescale Semiconductor, MCF5329CVM240J Datasheet - Page 46
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MCF5329CVM240J
Manufacturer Part Number
MCF5329CVM240J
Description
IC MPU RISC 240MHZ 256MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF532xr
Datasheet
1.MCF5328CVM240J.pdf
(50 pages)
Specifications of MCF5329CVM240J
Core Processor
Coldfire V3
Core Size
32-Bit
Speed
240MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG
Peripherals
DMA, LCD, PWM, WDT
Number Of I /o
94
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.4 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
256-MAPBGA
Family Name
MPC5xxx
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
240MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.8/2.5/3.3V
Operating Supply Voltage (max)
1.6/1.95/2.75/3.6V
Operating Supply Voltage (min)
1.4/1.7/2.25/3V
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
256
Package Type
MA-BGA
Processor Series
MCF532xx
Core
ColdFire V3
3rd Party Development Tools
JLINK-CF-BDM26, EWCF
Leaded Process Compatible
Yes
Rohs Compliant
Yes
Peak Reflow Compatible (260 C)
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCF5329CVM240J
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package Information
7.2
Figure 37
46
196X
13X
3
e
X
E
shows the MCF5327CVM240 package dimensions.
Y
b
0.30
0.10 Z
S
Package Dimensions—196 MAPBGA
0.20
Z
14 13 12 11
X
Y
Laser mark for pin 1
identification in
this area
Figure 37. 196 MAPBGA Package Dimensions (Case No. 1128A-01)
10
Bottom View
Top View
9
View M-M
MCF532x ColdFire
D
6
13X
S
5
e
4
3
2
®
1
Microprocessor Data Sheet, Rev. 5
A
B
C
D
G
H
K
M
N
E
F
J
L
P
Metalized mark for
pin 1 identification
in this area
K
M
M
A
A2
A1
Rotated 90 Clockwise
NOTES:
1. Dimensions are in millimeters.
2. Interpret dimensions and tolerances
3. Dimension B is measured at the
4. Datum Z (seating plane) is defined
5. Parallelism measurement shall
per ASME Y14.5M, 1994.
maximum solder ball diameter,
parallel to datum plane Z.
by the spherical crowns of the solder
balls.
exclude any effect of mark on top
surface of package.
Z
DIM
A1 0.27 0.47
A2 1.18 REF
Detail K
A 1.32 1.75
D 15.00 BSC
b 0.35 0.65
E 15.00 BSC
e
S
4
°
Min Max
Millimeters
1.00 BSC
0.50 BSC
Freescale Semiconductor
0.15 Z
0.30 Z
5