MCF5275CVM166J Freescale Semiconductor, MCF5275CVM166J Datasheet - Page 26

• Manufacturer Part Number: MCF5275CVM166J
• Description: IC MCU 166MHZ 256MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5275CVM166J

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 166MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 69
• Program Memory Type: ROMless
• Ram Size: 64K x 8
• Voltage - Supply (vcc/vdd): 1.4 V ~ 1.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-MAPBGA
• Processor Series: MCF527x
• Core: ColdFire V2
• 3rd Party Development Tools: JLINK-CF-BDM26, EWCF
• Development Tools By Supplier: NNDK-MOD5272-KIT, NNDK-MOD5270-KIT
• Leaded Process Compatible: No
• Rohs Compliant: No
• Peak Reflow Compatible (260 C): No
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Electrical Characteristics
Read/write bus timings listed in
26
1
B11
B12
B13
TSIZ[1:0]
A[23:0]
D[31:16]
Name
CS, BS, and OE transition after the falling edge of CLKOUT.
CLKOUT
BS[3:2]
TEA (H)
R/W
OE
TIP
CSn
TA
TS
(H)
(H)
CLKOUT high to data output (D[31:16]) valid
CLKOUT high to data output (D[31:16]) invalid
CLKOUT high to data output (D[31:16]) high impedance
B8
B8
B6a
B8
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
Table 13. External Bus Output Timing Specifications (continued)
Figure 8. Read/Write (Internally Terminated) SRAM Bus Timing
B6b
B6c
S0
B9
Characteristic
S1
Table 13
B4
S2
B7a
B7
are shown in
S3
Data Outputs
B5
S4
B7
B8
B6b
B8
S5
Figure
B6a
t
t
t
S0
CHDOV
CHDOI
CHDOZ
Symbol
B8
B9
B11
8,
Figure
S1
9, and
S2
Min
B0
1.0
—
—
S3
Figure
B7a
S4
B7
Freescale Semiconductor
B9
B9
B12
B13
10.
B9
Max
—
9
9
S5
Unit
ns
ns
ns