MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 180

IC MCU 512K FLASH 144-LQFP

MC9S12XDP512CAG

Manufacturer Part Number
MC9S12XDP512CAG
Description
IC MCU 512K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XDP512CAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Processor Series
S12XD
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN/I2C/SCI/SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
119
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (24-ch x 10-bit)
Cpu Family
HCS12
Device Core Size
16b
Frequency (max)
40MHz
Total Internal Ram Size
32KB
# I/os (max)
119
Number Of Timers - General Purpose
12
Operating Supply Voltage (typ)
2.5/5V
Operating Supply Voltage (max)
2.75/5.5V
Operating Supply Voltage (min)
2.35/3.15V
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 5 Analog-to-Digital Converter (S12ATD10B8CV2)
5.4
The ATD is structured in an analog and a digital sub-block.
5.4.1
The analog sub-block contains all analog electronics required to perform a single conversion. Separate
power supplies V
5.4.1.1
The sample and hold (S/H) machine accepts analog signals from the external surroundings and stores them
as capacitor charge on a storage node.
The sample process uses a two stage approach. During the first stage, the sample amplifier is used to
quickly charge the storage node.The second stage connects the input directly to the storage node to
complete the sample for high accuracy.
When not sampling, the sample and hold machine disables its own clocks. The analog electronics still draw
their quiescent current. The power down (ADPU) bit must be set to disable both the digital clocks and the
analog power consumption.
The input analog signals are unipolar and must fall within the potential range of V
5.4.1.2
The analog input multiplexer connects one of the 8 external analog input channels to the sample and hold
machine.
5.4.1.3
The sample amplifier is used to buffer the input analog signal so that the storage node can be quickly
charged to the sample potential.
5.4.1.4
The A/D Machine performs analog to digital conversions. The resolution is program selectable at either 8
or 10 bits. The A/D machine uses a successive approximation architecture. It functions by comparing the
stored analog sample potential with a series of digitally generated analog potentials. By following a binary
search algorithm, the A/D machine locates the approximating potential that is nearest to the sampled
potential.
When not converting the A/D machine disables its own clocks. The analog electronics still draws quiescent
current. The power down (ADPU) bit must be set to disable both the digital clocks and the analog power
consumption.
Only analog input signals within the potential range of V
in a non-railed digital output codes.
180
Functional Description
Analog Sub-Block
Sample and Hold Machine
Analog Input Multiplexer
Sample Buffer Amplifier
Analog-to-Digital (A/D) Machine
DDA
and V
SSA
allow to isolate noise of other MCU circuitry from the analog sub-block.
MC9S12XDP512 Data Sheet, Rev. 2.21
RL
to V
RH
(A/D reference potentials) will result
SSA
Freescale Semiconductor
to V
DDA
.

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