MC9S12XDP512CAG Freescale Semiconductor, MC9S12XDP512CAG Datasheet - Page 189

• Manufacturer Part Number: MC9S12XDP512CAG
• Description: IC MCU 512K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XDP512CAG

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 119
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: S12XD
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 32 KB
• Interface Type: CAN/I2C/SCI/SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 119
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (24-ch x 10-bit)
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 40MHz
• Total Internal Ram Size: 32KB
• # I/os (max): 119
• Number Of Timers - General Purpose: 12
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/3.15V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• For Use With: DEMO9S12XDT512E - BOARD DEMO FOR MC9S12XDT512EVB9S12XDP512E - BOARD DEMO FOR MC9S12XDP512
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6.3.1.1
All module level switches and flags are located in the module control register
Read: Anytime
Write: Anytime
Freescale Semiconductor
Reset
XGDBGM
XGFRZM
XGSSM
XGEM
Field
W
R
15
14
13
12
XGEM
15
0
0
XGE Mask — This bit controls the write access to the XGE bit. The XGE bit can only be set or cleared if a "1" is
written to the XGEM bit in the same register access.
Read:
Write:
0 Disable write access to the XGE in the same bus cycle
1 Enable write access to the XGE in the same bus cycle
XGFRZ Mask — This bit controls the write access to the XGFRZ bit. The XGFRZ bit can only be set or cleared
if a "1" is written to the XGFRZM bit in the same register access.
Read:
Write:
0 Disable write access to the XGFRZ in the same bus cycle
1 Enable write access to the XGFRZ in the same bus cycle
XGDBG Mask — This bit controls the write access to the XGDBG bit. The XGDBG bit can only be set or cleared
if a "1" is written to the XGDBGM bit in the same register access.
Read:
Write:
0 Disable write access to the XGDBG in the same bus cycle
1 Enable write access to the XGDBG in the same bus cycle
XGSS Mask — This bit controls the write access to the XGSS bit. The XGSS bit can only be set or cleared if a
"1" is written to the XGSSM bit in the same register access.
Read:
Write:
0 Disable write access to the XGSS in the same bus cycle
1 Enable write access to the XGSS in the same bus cycle
FRZM
XGATE Control Register (XGMCTL)
XG
14
0
0
This bit will always read "0".
This bit will always read "0".
This bit will always read "0".
This bit will always read "0".
= Unimplemented or Reserved
DBGM
XG
13
0
0
SSM
XG
12
Table 6-1. XGMCTL Field Descriptions (Sheet 1 of 3)
0
0
Figure 6-3. XGATE Control Register (XGMCTL)
FACTM
XG
11
0
0
MC9S12XDP512 Data Sheet, Rev. 2.21
10
0
0
SWEIFM
XG
0
0
9
XGIEM
0
0
8
Description
XGE XGFRZ XGDBG XGSS XGFACT
7
0
0
6
0
5
0
4
Figure
Chapter 6 XGATE (S12XGATEV2)
0
3
6-3.
2
0
0
SWEIF
XG
0
1
XGIE
0
0
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