SAK-XC888-8FFA 5V AC Infineon Technologies, SAK-XC888-8FFA 5V AC Datasheet - Page 140
![IC MCU 8BIT FLASH 64-LQFP](/photos/16/13/161308/qfp64_sml.jpg)
SAK-XC888-8FFA 5V AC
Manufacturer Part Number
SAK-XC888-8FFA 5V AC
Description
IC MCU 8BIT FLASH 64-LQFP
Manufacturer
Infineon Technologies
Series
XC8xxr
Datasheet
1.SAF-XC888CLM-6FFA_5V_AC.pdf
(144 pages)
Specifications of SAK-XC888-8FFA 5V AC
Core Processor
XC800
Core Size
8-Bit
Speed
103.2MHz
Connectivity
SSI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
48
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1.75K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
64-LFQFP
Data Bus Width
8 bit
Data Ram Size
1.75 KB
Interface Type
UART, SSC
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
48
Number Of Timers
4
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
For Use With
B158-H8743-X-X-7600IN - KIT STARTER XC886/888
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
SP000210992
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5
Chapter 5
5.1
Table 1
Table 1
Parameter
PG-TQFP-48 (XC886)
Thermal resistance junction
case
Thermal resistance junction
lead
PG-TQFP-64 (XC888)
Thermal resistance junction
case
Thermal resistance junction
lead
1) The thermal resistances between the case and the ambient (
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
Data Sheet
combined with the thermal resistances between the junction and the case (
(
(
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
the total thermal resistance between the junction and the ambient. This total junction ambient resistance
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
R
R
TJL
TJA
) given above, in order to calculate the total thermal resistance between the junction and the ambient
). The thermal resistances between the case and the ambient (
provides the thermal characteristics of the package used in XC886 and XC888.
provides the information of the XC886/888 package and reliability section.
Package and Quality Declaration
Package Parameters
Thermal Characteristics of the Packages
Symbol
R
R
R
R
TJC
TJL
TJC
TJL
CC -
CC -
CC -
CC -
Min.
133
Limit Values
R
TCA
Package and Quality Declaration
) , the lead and the ambient (
13
32.5
12.6
33.4
Max.
R
TCA
T
), the lead and the ambient (
J
=
R
T
TJC
A
+
R
Unit
K/W
K/W
K/W
K/W
), the junction and the lead
TJA
XC886/888CLM
×
P
D
, where the
Notes
1)2)
1)2)
1)2)
1)2)
V1.2, 2009-07
R
-
TLA
) are to be
R
R
TJA
R
TLA
TJA
is
)
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