PIC16LF84AT-04/SO Microchip Technology, PIC16LF84AT-04/SO Datasheet - Page 78
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PIC16LF84AT-04/SO
Manufacturer Part Number
PIC16LF84AT-04/SO
Description
IC MCU FLASH 1KX14 EE 18SOIC
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F84A-04P.pdf
(88 pages)
2.PIC16F84A-04P.pdf
(6 pages)
3.PIC16LF84A-04P.pdf
(125 pages)
4.PIC16LF84A-04P.pdf
(4 pages)
Specifications of PIC16LF84AT-04/SO
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
POR, WDT
Number Of I /o
13
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
FLASH
Eeprom Size
64 x 8
Ram Size
68 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
18-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Connectivity
-
PIC16F8X
11.2
DS30430C-page 78
DC Characteristics
Power Supply Pins
D001
D002
D003
D004
D010
D010A
D014
D020
D021
D021A
Note 1: This is the limit to which V
Parameter
*
†
No.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power down current in SLEEP mode does not depend on the oscillator type. Power-down current is
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be
These parameters are characterized but not tested.
Data in "Typ" column is at 5.0V, 25 C unless otherwise stated. These parameters are for design guidance only
and are not tested.
DC CHARACTERISTICS:
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1=external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
estimated by the formula I
V
V
V
S
I
I
DD
PD
Sym
DD
DR
POR
VDD
DD
Supply Voltage
RAM Data Retention
Voltage
V
ensure internal
Power-on Reset signal
V
internal Power-on
Reset signal
Supply Current
Power-down Current
DD
DD
; WDT enabled/disabled as specified.
Characteristic
start voltage to
rise rate to ensure
(1)
DD
(2)
DD
R
= V
can be lowered in SLEEP mode without losing RAM data.
measurements in active operation mode are:
(3)
DD
PIC16LF84, PIC16LF83 (Commercial, Industrial)
/2Rext (mA) with Rext in kOhm.
0.05*
Standard Operating Conditions (unless otherwise stated)
Operating temperature 0 C
1.5*
Min
2.0
—
—
—
—
—
—
—
PIC16F83/84
Typ† Max Units
V
7.3
3.0
0.4
0.4
15
—
—
—
1
SS
6.0
7.0
9.0
10
45
16
—
—
—
4
V/ms See section on Power-on Reset for details
mA
mA
V
V
V
-40 C
A
A
A
A
XT, RC, and LP osc configuration
Device in SLEEP mode
See section on Power-on Reset for details
RC and XT osc configuration
LP osc configuration
V
V
V
DD
DD
DD
F
F
WDT disabled
= 2.0V, WDT enabled, industrial
= 2.0V, WDT disabled, commercial
= 2.0V, WDT disabled, industrial
F
(During Flash programming)
T
T
OSC
OSC
A
A
OSC
+70 C (commercial)
+85 C (industrial)
= 2.0 MHz, V
= 32 kHz, V
= 2.0 MHz, V
DD
1998 Microchip Technology Inc.
, T0CKI = V
Conditions
DD
DD
DD
= 2.0V,
= 5.5V
DD
DD
= 5.5V
(4)
,
and V
SS
.