PIC18C252-E/SP Microchip Technology, PIC18C252-E/SP Datasheet - Page 283

IC MCU OTP 16KX16 A/D 28DIP

PIC18C252-E/SP

Manufacturer Part Number
PIC18C252-E/SP
Description
IC MCU OTP 16KX16 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Cr

Specifications of PIC18C252-E/SP

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
32KB (16K x 16)
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
PIC18C252E/SP
40-Lead Plastic Dual In-line (P) – 600 mil (PDIP)
2001 Microchip Technology Inc.
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-011
Drawing No. C04-016
n
eB
E1
E
Dimension Limits
2
1
D
§
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
A
A1
MIN
2.045
.160
.140
.015
.595
.530
.120
.008
.030
.014
.620
5
5
INCHES*
NOM
2.058
.100
.175
.150
.600
.545
.130
.012
.050
.018
.650
40
10
10
MAX
2.065
.190
.160
.625
.560
.135
.015
.070
.022
.680
B
B1
15
15
MIN
15.75
13.46
51.94
15.11
4.06
3.56
0.38
3.05
0.20
0.76
0.36
5
5
MILLIMETERS
PIC18CXX2
NOM
15.24
13.84
52.26
16.51
2.54
4.45
3.30
0.29
1.27
0.46
3.81
40
10
10
p
DS39026C-page 281
MAX
A2
15.88
14.22
52.45
17.27
4.83
4.06
3.43
0.38
1.78
0.56
L
15
15

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