PIC18C252-E/SP Microchip Technology, PIC18C252-E/SP Datasheet - Page 284

IC MCU OTP 16KX16 A/D 28DIP

PIC18C252-E/SP

Manufacturer Part Number
PIC18C252-E/SP
Description
IC MCU OTP 16KX16 A/D 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Cr

Specifications of PIC18C252-E/SP

Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
32KB (16K x 16)
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 5x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
PIC18C252E/SP
PIC18CXX2
28-Lead Ceramic Dual In-line with Window (JW) – 600 mil (CERDIP)
DS39026C-page 282
Number of Pins
Pitch
Top to Seating Plane
Ceramic Package Height
Standoff
Shoulder to Shoulder Width
Ceramic Pkg. Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Window Diameter
* Controlling Parameter
§ Significant Characteristic
JEDEC Equivalent: MO-103
Drawing No. C04-013
W
n
E1
eB
E
Dimension Limits
§
2
1
Units
A2
eB
A1
E1
B1
W
c
A
E
D
B
n
p
L
c
D
A1
A
MIN
1.430
.195
.155
.015
.595
.514
.125
.008
.050
.016
.610
.270
INCHES*
NOM
1.460
.100
.210
.160
.038
.600
.520
.138
.010
.058
.020
.660
.280
28
MAX
1.490
.225
.165
.060
.625
.526
.150
.012
.065
.023
.710
.290
B
B1
MIN
13.06
36.32
15.49
15.11
4.95
3.94
0.38
3.18
0.20
1.27
6.86
0.41
MILLIMETERS
NOM
2001 Microchip Technology Inc.
15.24
37.08
16.76
13.21
2.54
5.33
4.06
0.95
3.49
0.25
1.46
p
0.51
7.11
28
A2
MAX
15.88
13.36
37.85
18.03
L
5.72
4.19
1.52
0.30
1.65
0.58
7.37
3.81

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