DSPIC30F6011A-20I/PT Microchip Technology, DSPIC30F6011A-20I/PT Datasheet - Page 174
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
DSPIC30F6011A-20I/PT
Manufacturer Part Number
DSPIC30F6011A-20I/PT
Description
IC DSPIC MCU/DSP 132K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F6011A-30IPT.pdf
(234 pages)
3.DSPIC30F6011A-30IPT.pdf
(8 pages)
4.DSPIC30F6011A-30IPT.pdf
(10 pages)
5.DSPIC30F6011A-30IPT.pdf
(6 pages)
6.DSPIC30F6011A-30IPT.pdf
(8 pages)
7.DSPIC30F6011A-30IPT.pdf
(16 pages)
8.DSPIC30F6011A-20IPT.pdf
(238 pages)
Specifications of DSPIC30F6011A-20I/PT
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
52
Program Memory Size
132KB (44K x 24)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
6K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
For Use With
AC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Other names
DSPIC30F6011A20IP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC30F6011A-20I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F6011A-30IPT PDF datasheet #2
- DSPIC30F6011A-30IPT PDF datasheet #3
- DSPIC30F6011A-30IPT PDF datasheet #4
- DSPIC30F6011A-30IPT PDF datasheet #5
- DSPIC30F6011A-30IPT PDF datasheet #6
- DSPIC30F6011A-30IPT PDF datasheet #7
- DSPIC30F6011A-20IPT PDF datasheet #8
- Current page: 174 of 234
- Download datasheet (4Mb)
dsPIC30F6011A/6012A/6013A/6014A
23.1
TABLE 23-1:
TABLE 23-2:
TABLE 23-3:
DS70143E-page 174
dsPIC30F601xA-30I
dsPIC30F601xA-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 80-pin TQFP (14x14x1mm)
Package Thermal Resistance, 64-pin TQFP (14x14x1mm)
Package Thermal Resistance, 80-pin TQFP (12x12x1mm)
Package Thermal Resistance, 64-pin TQFP (10x10x1mm)
Note 1:
V
Operating Junction Temperature Range
DC Characteristics
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
INT
Junction to ambient thermal resistance, Theta-ja (
P
I
Range
/
O
=
=
V
∑
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
D D
(
{
V
×
DD
(
I
–
DD
Characteristic
V
O H
–
∑
Rating
} I
I
×
O H
)
OH
-40°C to 125°C
-40°C to 125°C
)
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Temp Range
+
∑
(
V
OL
×
I
OL
)
θ
JA
dsPIC30F601XA-30I
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
P
T
T
T
T
30
15
10
—
—
A
A
JA
JA
JA
JA
D
J
J
Min
Typ
-40
-40
-40
-40
34
34
39
39
Max MIPS
(T
© 2011 Microchip Technology Inc.
P
J
INT
- T
Max
Typ
—
—
—
—
—
—
—
—
dsPIC30F601XA-20E
+ P
A
)/
θ
I
/
O
JA
°C/W
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
20
10
—
—
—
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
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