AT89C51ED2-3CSUM Atmel, AT89C51ED2-3CSUM Datasheet - Page 114
AT89C51ED2-3CSUM
Manufacturer Part Number
AT89C51ED2-3CSUM
Description
IC 8051 MCU FLASH 64K 40DIP
Manufacturer
Atmel
Series
89Cr
Datasheet
1.ATWEBDVK-02RC.pdf
(137 pages)
Specifications of AT89C51ED2-3CSUM
Core Processor
8051
Core Size
8-Bit
Speed
60MHz
Connectivity
SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
34
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Eeprom Size
2K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
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25.
25.1
25.2
T
V
V
114
A
I = industrial ........................................................-40 ° C to 85 ° C
Storage Temperature .................................... -65 ° C to + 150 ° C
Voltage on V
VVoltage on Any Pin to V
Power Dissipation ........................................................... 1 W
CC
CC
Symbol
= -40°C to +85°C; V
V
V
V
V
=2.7V to 5.5V and F = 0 to 40 MHz (both internal and external code execution)
=4.5V to 5.5V and F = 0 to 60 MHz (internal code execution only)
V
V
OL1
IH1
OH
OL
IL
IH
E
lectrical Characteristics
Absolute Maximum Ratings
DC Parameters for Standard Voltage
AT89C51RD2/ED2
Parameter
Input Low Voltage
Input High Voltage except RST, XTAL1
Input High Voltage RST, XTAL1
Output Low Voltage, ports 1, 2, 3, 4
Output Low Voltage, port 0, ALE, PSEN
Output High Voltage, ports 1, 2, 3, 4
CC
to V
SS
......................................-0.5V to + 6.5V
SS
SS
= 0V;
.......................-0.5V to V
(6)
(6)
CC
+ 0.5V
0.2 V
V
V
V
(2)
0.7 V
0.9 V
CC
CC
CC
Min
-0.5
CC
- 0.3
- 0.7
- 1.5
+ 0.9
CC
CC
Note:
Typ
Stresses at or above those listed under “Absolute
Maximum Ratings” may cause permanent damage to
the device. This is a stress rating only and functional
operation of the device at these or any other condi-
tions above those indicated in the operational
sections of this specification is not implied. Exposure
to absolute maximum rating conditions may affect
device reliability.
Power dissipation is based on the maximum allow-
able die temperature and the thermal resistance of
the package.
0.2 V
V
V
CC
CC
Max
0.45
0.45
0.45
0.45
0.3
1.0
0.3
1.0
CC
+ 0.5
+ 0.5
- 0.1
Unit
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
Test Conditions
V
I
I
I
V
I
V
I
I
I
V
I
V
I
I
I
V
I
OL
OL
OL
OL
OL
OL
OL
OL
OH
OH
OH
OH
CC
CC
CC
CC
CC
CC
= 100 µA
= 1.6 mA
= 3.5 mA
= 0.8 mA
= 200 µA
= 3.2 mA
= 7.0 mA
= 1.6 mA
4235K–8051–05/08
= -10 µA
= -30 µA
= -60 µA
= -10 µA
= 4.5V to 5.5V
= 2.7V to 5.5V
= 4.5V to 5.5V
= 2.7V to 5.5V
= 5V ± 10%
= 2.7V to 5.5V
(4)
(4)
(4)
(4)
(4)
(4)
(4)
(4)
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