MC9S08DN32ACLH Freescale Semiconductor, MC9S08DN32ACLH Datasheet - Page 140
MC9S08DN32ACLH
Manufacturer Part Number
MC9S08DN32ACLH
Description
IC MCU 32K FLASH 1.5K RAM 64LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Specifications of MC9S08DN32ACLH
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
53
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08DN
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C, SCI, SPI
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08DZ60
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08DN32ACLH
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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IREFS=1
CLKS=01
PLLS=0
BDM Disabled
and LP=1
Chapter 8 Multi-Purpose Clock Generator (S08MCGV1)
8.4
8.4.1
140
Functional Description
Operational Modes
Internal (BLPI)
Low Power
Entered from any state
when MCU enters stop
Bypassed
BDM Enabled
or LP=0
IREFS=1
CLKS=00
PLLS=0
IREFS=1
CLKS=01
PLLS=0
FLL Engaged
Internal (FEI)
FLL Bypassed
Internal (FBI)
MC9S08DN60 Series Data Sheet, Rev 3
Figure 8-8. Clock Switching Modes
Stop
FLL Engaged
External (FEE)
PLL Bypassed
External (PBE)
FLL Bypassed
External (FBE)
PLL Engaged
External (PEE)
Returns to state that was active
before MCU entered stop, unless
RESET occurs while in stop.
IREFS=0
CLKS=00
PLLS=0
BDM Enabled
or LP=0
BDM Enabled
or LP=0
IREFS=0
CLKS=10
PLLS=0
IREFS=0
CLKS=10
PLLS=1
IREFS=0
CLKS=00
PLLS=1
External (BLPE)
Low Power
Bypassed
Freescale Semiconductor
IREFS=0
CLKS=10
BDM Disabled
and LP=1
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