SAF-XC167CI-32F40F BB-A Infineon Technologies, SAF-XC167CI-32F40F BB-A Datasheet - Page 63
![IC MCU 16BIT 256KB TQFP-144-19](/photos/39/69/396957/qfp144_sml.jpg)
SAF-XC167CI-32F40F BB-A
Manufacturer Part Number
SAF-XC167CI-32F40F BB-A
Description
IC MCU 16BIT 256KB TQFP-144-19
Manufacturer
Infineon Technologies
Series
XC16xr
Datasheet
1.SAF-XC167CI-32F20F_BB-A.pdf
(90 pages)
Specifications of SAF-XC167CI-32F40F BB-A
Core Processor
C166SV2
Core Size
16-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, I²C, SPI, UART/USART
Peripherals
PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
12K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 2.7 V
Data Converters
A/D 16x8/10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LFQFP
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
2xASC, 2xSSC, 1xI2C
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
103
Number Of Timers
11
Operating Supply Voltage
5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Packages
PG-TQFP-144
Max Clock Frequency
40.0 MHz
Sram (incl. Cache)
12.0 KByte
Can Nodes
2
A / D Input Lines (incl. Fadc)
16
Program Memory
256.0 KByte
For Use With
B158-H8963-X-X-7600IN - KIT EASY XC167CIMCBX167-NET - BOARD EVAL INFINEON CAN/ETHRNTMCBXC167-BASIC - BOARD EVAL BASIC INFINEON XC16X
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
FX167CI32F40FBBANT
SAFXC167CI32F40FBBAT
SP000104964
SP000224702
SAFXC167CI32F40FBBAT
SP000104964
SP000224702
Table 12
Port Output Driver
Mode
Strong driver
Medium driver
Weak driver
1) An output current above |
Table 13
Parameter
Power supply current (active)
with all peripherals active
Pad supply current
Idle mode supply current
with all peripherals active
Sleep and Power down mode
supply current caused by
leakage
Sleep and Power down mode
supply current caused by
leakage and the RTC running,
clocked by the main oscillator
Sleep and Power down mode
supply current caused by
leakage and the RTC running,
clocked by the auxiliary
oscillator at 32 kHz
1) During Flash programming or erase operations the supply current is increased by max. 5 mA.
2) The supply current is a function of the operating frequency. This dependency is illustrated in
3) The pad supply voltage pins (
Data Sheet
For any group of 16 neighboring port output pins the total output current in each direction (Σ
remain below 50 mA.
These parameters are tested at
all inputs at
amount of current is consumed even though no outputs are driven, because the drivers’ input stages are
switched and also the Flash module draws some power from the
4)
V
IL
Current Limits for Port Output Drivers
Power Consumption XC167 (Operating Conditions apply)
or
V
IH
4)
.
I
OXnom
Maximum Output Current
(
10 mA
4.0 mA
0.5 mA
I
OLmax
V
DDP
| may be drawn from up to three pins at the same time.
V
DDImax
4)
) mainly provides the current consumed by the pin output drivers. A small
, -
I
Sym-
bol
I
I
I
I
I
I
and maximum CPU clock frequency with all outputs disconnected and
OHmax
DDI
DDP
IDX
PDL
PDM
PDA
5)
7)
)
1)
Min.
–
–
–
–
–
–
61
Limit Values
Max.
10 +
3.0 ×
5
10 +
1.3 ×
128,000
× e
0.6 +
0.02 ×
+
0.1 +
I
PDL
-α
V
f
f
I
CPU
CPU
PDL
DDP
f
Nominal Output Current
(
2.5 mA
1.0 mA
0.1 mA
OSC
I
OLnom
supply.
Unit Test Condition
mA
mA
mA
mA
mA
mA
, -
Electrical Parameters
I
OHnom
f
3)
f
V
T
α =
4670 / (273 +
V
f
V
CPU
CPU
OSC
J
DDI
DDI
DDI
in [°C]
)
XC167CI-32F
in [MHz]
in [MHz]
I
in [MHz]
=
=
=
OL
Derivatives
V
V
V
V1.1, 2006-08
Figure
and Σ-
DDImax
DDImax
DDImax
I
OH
1)2)
2)
11.
6)
T
) must
J
)