LT6203CS8#PBF Linear Technology, LT6203CS8#PBF Datasheet - Page 19

• Manufacturer Part Number: LT6203CS8#PBF
• Description: IC OPAMP R-R INOUT DUAL LP 8SOIC
• Manufacturer: Linear Technology
• Type: General Purpose Amplifierr

Specifications of LT6203CS8#PBF

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 25 V/µs
• Gain Bandwidth Product: 100MHz
• Current - Input Bias: 3.8µA
• Voltage - Input Offset: 2600µV
• Current - Supply: 2.8mA
• Current - Output / Channel: 40mA
• Voltage - Supply, Single/dual (±): 2.5 V ~ 12.6 V, ±1.25 V ~ 6.3 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Rail/rail I/o Type: Rail to Rail Input/Output
• Number Of Elements: 2
• Unity Gain Bandwidth Product: 90MHz
• Common Mode Rejection Ratio: 60dB
• Input Offset Voltage: 2mV
• Input Bias Current: 2.5uA
• Single Supply Voltage (typ): 3/5/9/12V
• Dual Supply Voltage (typ): ±3/±5V
• Voltage Gain In Db: 96.9dB
• Power Supply Rejection Ratio: 60dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 2.5V
• Single Supply Voltage (max): 12.6V
• Dual Supply Voltage (min): ±1.25V
• Dual Supply Voltage (max): ±6.3V
• Technology: Bipolar
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Compliant

PACKAGE DESCRIPTION
3.5 0.05
2.10 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
0.25 0.05
(0.178 – 0.249)
.007 – .0098
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
.254 MIN
.0165 ±.0015
RECOMMENDED SOLDER PAD LAYOUT
2.38 0.05
(0.406 – 1.270)
.016 – .050
0.50
BSC
(MILLIMETERS)
INCHES
0.70 0.05
PACKAGE
OUTLINE
16-Lead Plastic SSOP (Narrow .150 Inch)
.045 ±.005
.150 – .165
0° – 8° TYP
(Reference LTC DWG # 05-08-1698 Rev C)
(0.38 ± 0.10)
.015 ± .004
8-Lead Plastic DFN (3mm × 3mm)
.0250 BSC
(Reference LTC DWG # 05-08-1641)
TOP MARK
(NOTE 6)
PIN 1
0.200 REF
GN Package
45°
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
DD Package
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
(5.817 – 6.198)
(0.203 – 0.305)
.229 – .244
.008 – .012
3. DRAWING NOT TO SCALE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEA
TYP
* DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
.0532 – .0688
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
(1.35 – 1.75)
LT6202/LT6203/LT6204
16 15 14 13
1
0.75 0.05
3.00 0.10
(4 SIDES)
2 3
(4.801 – 4.978)
.189 – .196*
0.00 – 0.05
4
12 11 10 9
5 6 7
1.65 0.10
(2 SIDES)
(0.635)
.0250
BSC
(0.102 – 0.249)
8
.004 – .0098
BOTTOM VIEW—EXPOSED PAD
0.25 0.05
R = 0.125
(3.810 – 3.988)
.150 – .157**
GN16 (SSOP) 0204
TYP
4
(0.229)
5
.009
REF
2.38 0.10
8
1
0.50 BSC
0.40 0.10
19
(DD8) DFN 0509 REV C
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