LT6203CS8#PBF Linear Technology, LT6203CS8#PBF Datasheet - Page 20

• Manufacturer Part Number: LT6203CS8#PBF
• Description: IC OPAMP R-R INOUT DUAL LP 8SOIC
• Manufacturer: Linear Technology
• Type: General Purpose Amplifierr

Specifications of LT6203CS8#PBF

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 25 V/µs
• Gain Bandwidth Product: 100MHz
• Current - Input Bias: 3.8µA
• Voltage - Input Offset: 2600µV
• Current - Supply: 2.8mA
• Current - Output / Channel: 40mA
• Voltage - Supply, Single/dual (±): 2.5 V ~ 12.6 V, ±1.25 V ~ 6.3 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Rail/rail I/o Type: Rail to Rail Input/Output
• Number Of Elements: 2
• Unity Gain Bandwidth Product: 90MHz
• Common Mode Rejection Ratio: 60dB
• Input Offset Voltage: 2mV
• Input Bias Current: 2.5uA
• Single Supply Voltage (typ): 3/5/9/12V
• Dual Supply Voltage (typ): ±3/±5V
• Voltage Gain In Db: 96.9dB
• Power Supply Rejection Ratio: 60dB
• Power Supply Requirement: Single/Dual
• Shut Down Feature: No
• Single Supply Voltage (min): 2.5V
• Single Supply Voltage (max): 12.6V
• Dual Supply Voltage (min): ±1.25V
• Dual Supply Voltage (max): ±6.3V
• Technology: Bipolar
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Compliant

LT6202/LT6203/LT6204
PACKAGE DESCRIPTION
20
(.0165 ± .0015)
0.42 ± 0.038
GAUGE PLANE
(.007)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
TYP
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
RECOMMENDED SOLDER PAD LAYOUT
(.206)
5.23
MIN
(.010)
0.254
DETAIL “A”
DETAIL “A”
(Reference LTC DWG # 05-08-1660 Rev F)
0° – 6° TYP
0.889 ± 0.127
(.0256)
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.65
BSC
(.021 ± .006)
0.53 ± 0.152
8-Lead Plastic MSOP
MS8 Package
SEATING
PLANE
(.193 ± .006)
(.118 ± .004)
4.90 ± 0.152
3.00 ± 0.102
(.009 – .015)
0.22 – 0.38
(NOTE 3)
TYP
(.043)
MAX
1.10
(.0256)
0.65
BSC
1
8
2 3
7 6 5
4
(.118 ± .004)
3.00 ± 0.102
(.0205)
(NOTE 4)
(.034)
0.52
0.86
REF
REF
0.1016 ± 0.0508
MSOP (MS8) 0307 REV F
(.004 ± .002)
620234fb