OP270EZ Analog Devices Inc, OP270EZ Datasheet - Page 20
OP270EZ
Manufacturer Part Number
OP270EZ
Description
IC OPAMP GP 5MHZ DUAL PREC 8CDIP
Manufacturer
Analog Devices Inc
Specifications of OP270EZ
Slew Rate
2.4 V/µs
Rohs Status
RoHS non-compliant
Amplifier Type
General Purpose
Number Of Circuits
2
Gain Bandwidth Product
5MHz
Current - Input Bias
5nA
Voltage - Input Offset
10µV
Current - Supply
4mA
Voltage - Supply, Single/dual (±)
±4.5 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Through Hole
Package / Case
8-CDIP (0.300", 7.62mm)
Op Amp Type
Low Noise
No. Of Amplifiers
2
Bandwidth
5MHz
Supply Voltage Range
± 4.5V To ± 18V
Amplifier Case Style
DIP
No. Of Pins
8
Channel Separation
175
Common Mode Rejection Ratio
125
Current, Input Bias
5 nA
Current, Input Offset
1 nA
Current, Supply
4 mA
Impedance, Thermal
12 °C/W
Number Of Amplifiers
Dual
Package Type
CDIP-8
Resistance, Input
0.4 Megohms (Differential), 20 Gigaohms (Common-Mode)
Temperature, Operating, Range
-40 to +85 °C
Voltage, Gain
2300 V/mV
Voltage, Input
±12.5 V
Voltage, Noise
3.6 nV/sqrt Hz
Voltage, Offset
10 μV
Voltage, Output, High
+13.5 V
Voltage, Output, Low
-13.5 V
Voltage, Supply
±15 V
Output Type
-
Current - Output / Channel
-
-3db Bandwidth
-
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
OP270EZ
Manufacturer:
PMI
Quantity:
5 510
Company:
Part Number:
OP270EZ/FZ
Manufacturer:
PMI
Quantity:
5 510
Company:
Part Number:
OP270EZ/FZ
Manufacturer:
NAIS
Quantity:
5 510
OP270
ORDERING GUIDE
Model
OP270EZ
OP270FZ
OP270GP
OP270GPZ
OP270GS
OP270GS-REEL
OP270GSZ
OP270GSZ-REEL
1
2
©2001–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
θ
printed circuit board for SOIC package.
Z = RoHS Compliant Part.
JA
is specified for worst-case mounting conditions, that is, θ
2
2
2
T
V
75
150
250
250
A
OS
= +25°C
Max (μV)
COPLANARITY
0.30 (0.0118)
0.10 (0.0039)
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
θ
(°C/W)
12
12
37
27
D00325-0-2/10(E)
JC
Figure 50. 16-Lead Standard Small Outline Package [SOIC_W]
16
1
10.50 (0.4134)
10.10 (0.3976)
0.51 (0.0201)
0.31 (0.0122)
1.27 (0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013- AA
Dimensions shown in millimeters and (inches)
θ
(°C/W)
134
134
96
92
JA
BSC
JA
is specified for device in socket for CERDIP and PDIP packages; θ
1
9
8
Rev. E | Page 20 of 20
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
7.60 (0.2992)
7.40 (0.2913)
SEATING
PLANE
2.65 (0.1043)
2.35 (0.0925)
Wide Body
(RW-16)
S-Suffix
10.65 (0.4193)
10.00 (0.3937)
0.33 (0.0130)
0.20 (0.0079)
8°
0°
Package Description
16-Lead SOIC_W
16-Lead SOIC_W
8-Lead CERDIP
8-Lead CERDIP
8-Lead PDIP
8-Lead PDIP
16-Lead SOIC_W
16-Lead SOIC_W
1.27 (0.0500)
0.40 (0.0157)
45°
JA
is specified for device soldered to
Package
Option
Q-8 (Z-Suffix)
Q-8 (Z-Suffix)
N-8 (P-Suffix)
N-8 (P-Suffix)
RW-16 (S-Suffix)
RW-16 (S-Suffix)
RW-16 (S-Suffix)
RW-16 (S-Suffix)