BA10358F-E2 Rohm Semiconductor, BA10358F-E2 Datasheet - Page 18

• Manufacturer Part Number: BA10358F-E2
• Description: IC OPAMP DUAL 32V SOP8
• Manufacturer: Rohm Semiconductor

Specifications of BA10358F-E2

• Slew Rate: 0.2 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Gain Bandwidth Product: 500kHz
• Current - Input Bias: 45nA
• Voltage - Input Offset: 2000µV
• Current - Supply: 700µA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/dual (±): 3 V ~ 32 V, ±1.5 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOP
• Op Amp Type: General Purpose
• No. Of Amplifiers: 2
• Bandwidth: 1.2MHz
• Supply Voltage Range: 3V To 32V
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +85°C
• Number Of Channels: 2
• Voltage Gain Db: 100 dB
• Common Mode Rejection Ratio (min): 65 dB
• Input Offset Voltage: 7 mV
• Operating Supply Voltage: 3 V to 32 V
• Supply Current: 0.7 mA
• Maximum Power Dissipation: 550 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Maximum Dual Supply Voltage: +/- 16 V
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details
• Other names: BA10358F-E2TR

When using the unit above Ta=25[ ], subtract the value above per degree[ ]. Permissible dissipation is the value
when FR4 glass epoxy board 70[mm] 70[mm] 1.6[mm] (cooper foil area below 3[ ]) is mounted.
Power dissipation (total loss) indicates the power that can be consumed by IC at Ta=25 (normal temperature).IC is heated
when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that can
be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited.
Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal
resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum
value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead
frame of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called
thermal resistance, represented by the symbol j-a[ /W]. The temperature of IC inside the package can be estimated by this
thermal resistance. Fig.6 (a) shows the model of thermal resistance of the package. Thermal resistance
temperature Ta, junction temperature Tj, and power dissipation Pd can be calculated by the equation below :
Derating curve in Fig.6 (b) indicates power that can be consumed by IC with reference to ambient temperature. Power that
can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at
certain ambient temperature. This gradient, is determined by thermal resistance ja. Thermal resistance ja depends on chip
size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same
of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Fig.7(a)-(d) show
a derating curve for an example of BA10358, BA10324A, BA2904, and BA2902.
6.2
*1
Derating curve
5.5
*2
7.0
*3
ja = ( Tj
1000
1000
800
600
400
200
800
600
400
200
4.9
Chip surface temperature Tj [ ]
0
*4
0
Ambient temperature Ta [ ]
0
0
550mW (*2)
ja
690mW( *6)
620mW (*1)
780mW( *5)
590mW (*7)
(a) Thermal resistance
Ta ) / Pd [ /W]
25
6.2
*5
25
(Tj Ta) / Pd
Ambient temperature Ta [ ]
Ambient temperature Ta [ ]
BA2904F
BA3404F
BA10358F
50
50
5.5
*6
BA2904FV
75
Fig1. Thermal resistance and derating curve
BA2904FVM
BA3404FVM
BA10358FV
75
4.8
*7
100
BA3404F
Fig2. Derating curve
BA3404FVM
[ /W]
100
125
7.0
*8
125
150
5.3
*9
18/20
*10
4.9
1000
1000
800
600
400
200
800
600
400
200
0
0
Power dissipation of LSI [W]
[mW/ ]
P2
P1
0
0
870mW( *8)
660mW( *9)
610mW (*10)
Unit
0
700mW (*3)
490mW (*4)
Pd (max)
25
25
25
Ambient temperature Ta [ ]
Ambient temperature Ta [ ]
BA2902FV
BA10324AFV
50
(b) Derating curve
50
Ambient temperature Ta [
50
BA2902KN
' ja1
75
BA10324AF
75
75
100
ja1
ja2 < ja1
BA2902F
100
' ja2
125
100
ja2
125
150
125
]
Tj ' (max)
150
Tj (max)
ja, ambient