MC9S08AC32CPUE Freescale Semiconductor, MC9S08AC32CPUE Datasheet - Page 17

IC MCU 8BIT 32K FLASH 64-LQFP

MC9S08AC32CPUE

Manufacturer Part Number
MC9S08AC32CPUE
Description
IC MCU 8BIT 32K FLASH 64-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08AC32CPUE

Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
54
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
S08AC
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
54
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08AC60E, DEMOACEX, DEMOACKIT, DCF51AC256, DC9S08AC128, DC9S08AC16, DC9S08AC60, DEMO51AC256KIT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Freescale Semiconductor
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Section Number
15.7 Reset Overview .............................................................................................................................275
15.8 Interrupts .......................................................................................................................................275
15.9 The Differences from TPM v2 to TPM v3 ....................................................................................277
16.1 Introduction ...................................................................................................................................281
16.2 Background Debug Controller (BDC) ..........................................................................................282
16.3 On-Chip Debug System (DBG) ....................................................................................................291
16.4 Register Definition ........................................................................................................................295
A.1 Introduction ....................................................................................................................................303
A.2 Parameter Classification.................................................................................................................303
A.3 Absolute Maximum Ratings...........................................................................................................304
A.4 Thermal Characteristics..................................................................................................................305
A.5 ESD Protection and Latch-Up Immunity .......................................................................................306
A.6 DC Characteristics..........................................................................................................................308
A.7 Supply Current Characteristics.......................................................................................................311
A.8 ADC Characteristics.......................................................................................................................314
A.9 Internal Clock Generation Module Characteristics ........................................................................317
Freescale Semiconductor
15.6.1 Counter ............................................................................................................................270
15.6.2 Channel Mode Selection .................................................................................................272
15.7.1 General ............................................................................................................................275
15.7.2 Description of Reset Operation .......................................................................................275
15.8.1 General ............................................................................................................................275
15.8.2 Description of Interrupt Operation ..................................................................................276
16.1.1 Features ...........................................................................................................................282
16.2.1 BKGD Pin Description ...................................................................................................283
16.2.2 Communication Details ..................................................................................................284
16.2.3 BDC Commands .............................................................................................................288
16.2.4 BDC Hardware Breakpoint .............................................................................................290
16.3.1 Comparators A and B ......................................................................................................291
16.3.2 Bus Capture Information and FIFO Operation ...............................................................291
16.3.3 Change-of-Flow Information ..........................................................................................292
16.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................292
16.3.5 Trigger Modes .................................................................................................................293
16.3.6 Hardware Breakpoints ....................................................................................................295
16.4.1 BDC Registers and Control Bits .....................................................................................295
16.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................297
16.4.3 DBG Registers and Control Bits .....................................................................................298
Electrical Characteristics and Timing Specifications
MC9S08AC60 Series Data Sheet, Rev. 2
Development Support
Appendix A
Chapter 16
Title
Page
17

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