MCF52259CVN80 Freescale Semiconductor, MCF52259CVN80 Datasheet - Page 29

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MCF52259CVN80

Manufacturer Part Number
MCF52259CVN80
Description
MCU 32BIT COLDFIRE V2 144MAPBGA
Manufacturer
Freescale Semiconductor
Series
MCF5225xr
Datasheet

Specifications of MCF52259CVN80

Core Processor
Coldfire V2
Core Size
32-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals
DMA, LVD, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-MAPBGA
Controller Family/series
ColdFire
Ram Memory Size
64KB
No. Of Timers
2
Embedded Interface Type
CAN, Ethernet, I2C, QSPI, UART, USB
Digital Ic Case Style
MAPBGA
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCF52259CVN80
Manufacturer:
FREESCALE
Quantity:
124
Electrical Characteristics
2.5
2.6
29
2
Name
EP1a
EP1
EP2
EP3
EP4
EP5
EP6
EP7
EP8
EP9
Reprogramming of a flash memory array block prior to erase is not required.
EzPort Electrical Specifications
ESD Protection
EPCK frequency of operation (all commands except READ)
EPCK frequency of operation (READ command)
EPCS_b negation to next EPCS_b assertion
EPCS_B input valid to EPCK high (setup)
EPCK high to EPCS_B input invalid (hold)
EPD input valid to EPCK high (setup)
EPCK high to EPD input invalid (hold)
EPCK low to EPQ output valid (out setup)
EPCK low to EPQ output invalid (out hold)
EPCS_B negation to EPQ tri-state
1
2
Characteristics
ESD target for Human Body Model
ESD target for Machine Model
HBM circuit description
MM circuit description
Number of pulses per pin (HBM)
Number of pulses per pin (MM)
Interval of pulses
• Positive pulses
• Negative pulses
• Positive pulses
• Negative pulses
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
Automotive Grade Integrated Circuits.
A device is defined as a failure if after exposure to ESD pulses the device no longer
meets the device specification requirements. Complete DC parametric and functional
testing is performed per applicable device specification at room temperature followed by
hot temperature, unless specified otherwise in the device specification.
Table 12. ESD Protection Characteristics
Table 11. EzPort Electrical Specifications
MCF52259 ColdFire Microcontroller, Rev. 4
Characteristic
Symbol
R
R
HBM
MM
series
series
C
C
Value
2000
1500
200
100
200
0
1
1
3
3
1
1, 2
2 × T
Min
5
5
2
5
0
Units
cyc
sec
pF
pF
V
V
Freescale Semiconductor
f
f
sys
sys
Max
12
12
/ 2
/ 8
MHz
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns

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