M5373EVB Freescale Semiconductor, M5373EVB Datasheet - Page 15

• Manufacturer Part Number: M5373EVB
• Description: KIT EVAL FOR MCF537X
• Manufacturer: Freescale Semiconductor
• Series: ColdFire®r
• Type: MPUr

Specifications of M5373EVB

• Contents: Module and Misc Hardware
• For Use With/related Products: MCF537x
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

5.2
The average chip-junction temperature (T
Where:
For most applications P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from
for a known T
for any value of T
Freescale Semiconductor
1
2
3
4
5
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψ
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written in conformance with Psi-JT.
JMA
T
Q
P
P
P
A
JMA
D
INT
I/O
and Ψ
Thermal Characteristics
A
. Using this value of K, the values of P
jt
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
A
.
= Ambient Temperature, °C
= Package Thermal Resistance, Junction-to-Ambient, °C/W
= P
= I
= Power Dissipation on Input and Output Pins — User Determined
I/O
INT
DD
Characteristic
< P
× IV
+ P
JmA
INT
I/O
DD
MCF537x ColdFire
and power dissipation specifications in the system design to prevent device junction
and can be ignored. An approximate relationship between P
, Watts - Chip Internal Power
K
J
) in °C can be obtained from:
=
Table 5. Thermal Characteristics
P
Four layer board
Four layer board
D
T
J
×
P
(2s2p)
(2s2p)
(
=
D
T
D
T
A
®
=
and T
A
×
Microprocessor Data Sheet, Rev. 4
-------------------------------- -
(
+
T
273°C
(
J
P
+
J
D
K
273°C
can be obtained by solving
×
)
Θ
+
Symbol
JMA
θ
θ
Q
)
θ
θ
Ψ
JMA
JMA
T
JB
JC
JMA
)
jt
j
×
P
2
D
256MBGA
Equation 3
37
34
27
16
4
105
1,5
1,2
1,2
3
4
Equation 1
196MBGA
by measuring P
D
jt
42
38
parameter, the device power
5
105
and T
32
19
1,5
1,2
1,2
3
4
Electrical Characteristics
and
J
(if P
Equation 2
160QFP
I/O
D
49
44
12
105
40
39
(at equilibrium)
is neglected) is:
1,2
1,2
1,5
3
4
iteratively
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
Eqn. 1
Eqn. 2
Eqn. 3
o
C
15