WS1102-BLK Avago Technologies US Inc., WS1102-BLK Datasheet

MODULE PA CDMA/AMPS 824-849MHZ

WS1102-BLK

Manufacturer Part Number
WS1102-BLK
Description
MODULE PA CDMA/AMPS 824-849MHZ
Manufacturer
Avago Technologies US Inc.
Type
Power Amplifierr
Datasheet

Specifications of WS1102-BLK

Current - Supply
460mA
Frequency
824MHz ~ 849MHz
Gain
28.5dB
Package / Case
8-SMD, No Leads
Rf Type
CDMA, AMPS
Voltage - Supply
3.2 V ~ 4.2 V
Operating Frequency
849 MHz
Supply Current
500 mA
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 30 C
Number Of Channels
1 Channel
Frequency (max)
849MHz
Power Supply Requirement
Single
Single Supply Voltage (min)
3.2V
Single Supply Voltage (typ)
3.4V
Single Supply Voltage (max)
4.2V
Package Type
SMD
Dual Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
Not RequiredV
Dual Supply Voltage (max)
Not RequiredV
Operating Temperature Classification
Commercial
Operating Temp Range
-30C to 85C
Pin Count
8
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Noise Figure
-
P1db
-
Test Frequency
-
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
WS1102-BLK
Manufacturer:
AVAGO
Quantity:
3 840
Part Number:
WS1102-BLK
Manufacturer:
AVGAO
Quantity:
20 000
WS1102
3 x 3 Power Amplifier Module for CDMA/AMPS (824–849 MHz)
Data Sheet
Description
The WS1102 is a CDMA (Code Division Multiple Access)
and AMPS (Advanced Mobile Phone Service) power
amplifier module designed for handsets operating
in
features CoolPAM circuit technology that offers
state-of-the-art reliability, temperature stability and
ruggedness.
The
requirements to and beyond 28 dBm output power. The
3 mm x 3 mm form factor 8-pin surface mount package
is self contained, incorporating 50 ohm input and output
matching networks.
Functional Block Diagram
RF Input (2)
the
WS1102
824–849 MHz
MMIC
meets
Match
Input
Bias Circuit & Control Logic
stringent
bandwidth.
Vcont ( 3 )
DA
Vcc1(1)
CDMA
Match
Stage
Inter
The
Vref ( 4 )
WS1102
linearity
PA
Vcc2(8)
Features
• Good linearity
• Excellent efficiency: 40% at Pout = 28 dBm;
• 8-pin surface mounting package
• Internal 50Ω matching networks for both RF Input
• CDMA 95A/B, CDMA2000-1X/EVDO
Applications
• Digital Cellular (CDMA)
• Analog Cellular (AMPS)
19% at Pout = 16 dBm (without a DC/DC converter)
(3 mm x 3 mm x 1.1 mm)
and output
Output
Match
MODULE
RF Output (7)

Related parts for WS1102-BLK

WS1102-BLK Summary of contents

Page 1

... WS1102 Power Amplifier Module for CDMA/AMPS (824–849 MHz) Data Sheet Description The WS1102 is a CDMA (Code Division Multiple Access) and AMPS (Advanced Mobile Phone Service) power amplifier module designed for handsets operating in the 824–849 MHz bandwidth. features CoolPAM circuit technology that offers state-of-the-art reliability, temperature stability and ruggedness ...

Page 2

Table 1. Absolute Maximum Ratings [1] Parameter Symbol RF Input Power Supply Voltage Reference Voltage V ref Storage Temperature T stg Table 2. Recommended Operating Conditions Parameter Symbol DC Supply Voltage ...

Page 3

Table 4-1. Electrical Characteristics for CDMA Mode (Vcc=3.4V, Vref=2.85V, T=25°C) Characteristics Gain Power Added Efficiency Total Supply Current Quiescent Current Reference Current Control Current [1] Total Current in Power-down Mode Ipd 0.90 MHz offset ACPR in High Power Mode ...

Page 4

Characterization Data (Vcc=3.4V, Vref=2.85V, T=25°C, Fo=837 MHz) 600 500 400 300 200 100 Pout (dBm) Figure 1. Total Current vs. Output Power ...

Page 5

Evaluation Board Description Vcc1 1 Vcc1 C1 C5 2.2 F 560 Vcont 6.2 Kohm 3 Vcont C3 100 pF Vref 4 Vref C4 100 pF Figure 6. Evaluation Board Schematic. Figure 7. Evaluation Board Assembly Diagram.  Vcc2 Vcc2 8 ...

Page 6

Package Dimensions and Pin Descriptions Pin 1 Mark ± 0.1 TOP VIEW 0.70 0.25 0.25 0.40 0.40 1.40 BOTTOM VIEW Figure 8. Package Dimensional Drawing and Pin Descriptions. Notes: 1. All dimensions are in millimeters. 2. Dimensions Without Tolerance: .XX ‡ ...

Page 7

Package Dimensions and Pin Descriptions, Pin #1 Mark Figure 9. Marking Specifications.  continued Manufacturing Part Number Lot Number P Manufacturing Site YY Manufacturing Year WW Work Week AAAAA Assembly ...

Page 8

... Place C3 and C4 close to pin 1 (Vcc1) and pin 8 (Vcc2). These capacitors can affect the RF performance. 4. Use 50Ω transmission line between PAM and Duplexer and make it as short as possible to reduce conduction loss. 5. π-type circuit topology is good to use for matching circuit between PA and Duplexer. 6. Pull-up resistor (R1) should be used to limit current drain. 6.2 kΩ is recommended for WS1102 ...

Page 9

... Probability Distribution Function implies that what is important for longer talk time is the efficiency of low or medium power range rather than the efficiency at full power. WS1102 idle current and operating current at 16 dBm nominal condition. Average current calculated with CDMA PDF urban area and suburban area. This PA with low current consumption prolongs talk time by no less than 30 minutes compared to other PAs ...

Page 10

... PCB Design Guidelines The recommended WS1102 PCB Land pattern is shown in Figure 14 and Figure 15. The substrate is coated with solder mask between the I/O and conductive paddle to protect the gold pads from short circuit that is caused by solder bleeding/bridging. Stencil Design Guidelines A properly designed solder screen or stencil is required to ensure optimum amount of solder paste is deposited onto the PCB pads ...

Page 11

... Ordering Information Part Number Number of Devices WS1102-BLK 100 WS1102-TR1 2500 Tape and Reel Information Dimension List Annote Milimeter 3.40 ± 0.10 A0 3.40 ± 0.10 B0 1.70 ± 0.10 K0 1.55 ± 0.05 D0 1.60 ± 0.10 D1 4.00 ± 0.10 P0 8.00 ± 0.10 P1 Figure 17. Tape and Reel Format – 3mm x 3mm. ...

Page 12

Tape and Reel Information, continued all dimensions are in millimeters Figure 18. Plastic Reel Format 13"/14". 1 ...

Page 13

... MSL classification level according to the JEDEC standard IPC/JEDEC J-STD-020B and J-STD-033. WS1102 is MSL3. Thus, according to the J-STD-033 p.11 the maximum Manufacturers Exposure Time (MET) for ESD damage this part is 168 hours. After this time period, the part would need to be removed from the reel, de-taped and then re-baked ...

Page 14

Handling and Storage, continued Figure 19. Typical SMT Reflow Profile for Maximum Temperature = 250+0/-5°C. Table 7. Typical SMT Reflow Profile for Maximum Temperature = 250+0/-5°C Profile Feature Average ramp-up rate ( Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) ...

Page 15

Handling and Storage, continued Storage Conditions Packages described in this document must be stored in sealed moisture barrier, anti-static bags. Shelf life in a sealed moisture barrier bag is 12 months at <40 90% relative humidity (RH) J-STD-033 p.7. Out-of-Bag Time Duration ...

Page 16

Handling and Storage, continued Table 8. Recommended Equivalent Total Floor Life (days) @ 20°C, 25°C & 30°C For ICs with Novolac, Biphenyl and Multifunctional Epoxies (Reflow at same temperature at which the component was classified) For product information and a complete list ...

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