WS1102-BLK Avago Technologies US Inc., WS1102-BLK Datasheet - Page 10

• Manufacturer Part Number: WS1102-BLK
• Description: MODULE PA CDMA/AMPS 824-849MHZ
• Manufacturer: Avago Technologies US Inc.
• Type: Power Amplifierr

Specifications of WS1102-BLK

• Current - Supply: 460mA
• Frequency: 824MHz ~ 849MHz
• Gain: 28.5dB
• Package / Case: 8-SMD, No Leads
• Rf Type: CDMA, AMPS
• Voltage - Supply: 3.2 V ~ 4.2 V
• Operating Frequency: 849 MHz
• Supply Current: 500 mA
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 30 C
• Number Of Channels: 1 Channel
• Frequency (max): 849MHz
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3.2V
• Single Supply Voltage (typ): 3.4V
• Single Supply Voltage (max): 4.2V
• Package Type: SMD
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temperature Classification: Commercial
• Operating Temp Range: -30C to 85C
• Pin Count: 8
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• P1db: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant

10
PCB Design Guidelines
The recommended WS1102 PCB Land pattern is shown
in Figure 14 and Figure 15. The substrate is coated with
solder mask between the I/O and conductive paddle to
protect the gold pads from short circuit that is caused by
solder bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown in Figure 16.
Reducing the stencil opening can potentially generate
more voids. On the other hand, stencil openings larger than
100% will lead to excessive solder paste smear or bridging
across the I/O pads or conductive paddle to adjacent I/O
pads. Considering the fact that solder paste thickness will
directly affect the quality of the solder joint, a good choice
is to use laser cut stencil composed of 0.100 mm (4 mils) or
0.127 mm (5mils) thick stainless steel which is capable of
producing the required fine stencil outline.
Figure 14. Metallization.
Figure 15. Solder Mask Opening.
Figure 16. Solder Paste Stencil Aperture.
0.5
0.8
0.4
0.8
0.4
0.8
0.25
0.75
0.65
0.65
1.4
1.1
0.5
on 0.5mm pitch
0.55
Ø 0.3mm
0.5
1.325
1.05