ATA555814C-DDB Atmel, ATA555814C-DDB Datasheet - Page 40
![no-image](/images/manufacturer_photos/0/0/78/atmel_sml.jpg)
ATA555814C-DDB
Manufacturer Part Number
ATA555814C-DDB
Description
IC IDIC 1KBIT R/W DIE
Manufacturer
Atmel
Datasheet
1.ATA555812C-DDB.pdf
(52 pages)
Specifications of ATA555814C-DDB
Function
Read/Write
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- Current page: 40 of 52
- Download datasheet (2Mb)
10. Ordering Information
10.1
10.2
40
ATA5558
ATA5558
ATA5558
Available Order Codes
Engineering Samples
ATA5558
a b
a b
a b
- x x x
- x x x
- x x x
ATA555811-DDB
ATA555812-DDB
ATA555812-DBB
ATA555814-DDB
ATA555814-DBB
ATA555815-PP
Die-samples are supplied 50 pcs. Each in waffle pack, with standard part number applied.
Package
Package
Package
- DDB
- DDB
- DDT
- DBB
- PAE
-DDT
Type
Type
Type
- PP
11
12
14
15
6” sawn wafer on foil with ring, thickness 150 µm
(approx. 6 mil)
Die in waffle pack, 150 µm (approx. 6 mil), planned
Standard pads without on-chip C
6” sawn wafer on foil with ring, thickness 150 µm
(approx. 6 mil)
6” sawn wafer on foil with ring and Goldbumps 25 µm,
thickness 150 µm (approx. 6 mil)
Die in waffle pack, 150 µm (approx. 6 mil), planned
Mega Pads with on-chip 80 pF
Mega Pads with on-chip 210 pF
Plastic transponder
NOA3 micromodule with 330 pF lead-free, planned
Drawing
See
See
Drawing
See
See
See
Drawing
See
See
Figure 10-1 on page 42
Figure 10-2 on page 43
Figure 10-9 on page 50
Figure 10-9 on page 50
Figure 10-2 on page 43
Figure 10-8 on page 49
Figure 10-9 on page 50
4681E–RFID–11/09
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