EM35X-BBRD Ember, EM35X-BBRD Datasheet - Page 229

EM35X BREAKOUT BOARD

EM35X-BBRD

Manufacturer Part Number
EM35X-BBRD
Description
EM35X BREAKOUT BOARD
Manufacturer
Ember
Datasheet

Specifications of EM35X-BBRD

Frequency
2.4GHz
For Use With/related Products
EM35x
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
636-1013
19.2 Solder Temperature Profile
Figure 19-5 illustrates the solder temperature profile for the EM35x. This temperature profile is similar for
other RoHS compliant packages, but manufacturing lines should be programmed with this profile in order to
guarantee proper solder connection to the PCB.
Table 19-1 contains the temperature profile parameters.
Average Ramp Up Rate (from Tsoak
Maximum Soak Temperature (Tsoak
Minimum Soak Temperature (Tsoak
Time within 5°C of Tpeak
Time from 25°C to Tpeak
Ramp Down Rate
Time above TL
Parameter
Tpeak
Table 19-1. Solder Reflow Parameters
TL
Figure 19-5. EM35x Reflow Profile
Final
19-3
max
to Tpeak)
min
max
)
)
EM351 / EM357
3°C per second max
6°C per second max
60 – 150 seconds
20 – 40 seconds
8 minutes, max
260 + 0°C
Value
150°C
200°C
217°C
120-035X-000G

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