SA58643DP,118 NXP Semiconductors, SA58643DP,118 Datasheet
SA58643DP,118
Specifications of SA58643DP,118
935278795118
SA58643DP-T
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SA58643DP,118 Summary of contents
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SA58643 Single-Pole Double-Throw (SPDT) switch Rev. 01 — 20 November 2006 1. General description The SA58643 is a wideband RF switch fabricated in BiCMOS technology and incorporating on-chip CMOS/TTL compatible drivers. Its primary function is to switch signals in the ...
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... NXP Semiconductors 4. Ordering information Table 1. Type number SA58643DP 5. Block diagram Fig 1. Block diagram of SA58643 6. Pinning information 6.1 Pinning Fig 2. Pin configuration for TSSOP8 6.2 Pin description Table 2. Symbol V DD ENCH1 GND INPUT OUT2 AC_GND OUT1 SA58643_1 Product data sheet Ordering information ...
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... NXP Semiconductors 7. Equivalent circuit INPUT ENCH1 (logic 0 level) Fig 3. Equivalent circuit 8. Limiting values Table 3. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol j(max) P INPUT_OUT1_OUT2 T stg [1] Maximum dissipation is determined by the operating ambient temperature and the thermal resistance, R th(j-a) 9. Recommended operating conditions Table 4 ...
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... NXP Semiconductors 10. Static characteristics Table 5. Static characteristics unless otherwise specified. DD amb Symbol Parameter I supply current DD V threshold voltage th V HIGH-level input voltage IH V LOW-level input voltage IL I LOW-level input current on pin ENCH1 IL(ENCH1) I HIGH-level input current on pin ENCH1 IH(ENCH1) [1] The ENCH1 input must be connected to a valid logic level for proper operation of the SA58643. ...
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... NXP Semiconductors 12. Performance curves 200 160 120 T = +85 C amb + 3.0 4.0 Fig 4. Supply current versus V 0 (dB +25 C amb Fig 6. Loss versus frequency and (dB +85 C amb + Fig 8. Loss versus frequency and temperature SA58643_1 Product data sheet 002aab697 S 21 (dB) 5.0 6.0 ...
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... NXP Semiconductors (dB CH2 CH1 + amb DD Fig 10. Isolation matching versus frequency; CH1 versus CH2 (dB + amb DD Fig 12. Output match ON-channel versus frequency (dB +85 C amb 10 + Fig 14. OFF-channel match versus frequency and temperature SA58643_1 Product data sheet 002aab702 S 11 (dB (MHz) Fig 11. Input match ON-channel versus frequency and ...
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... NXP Semiconductors 60 intercept point (dBm) 50 IP2 40 IP3 3.0 4 +25 C amb Fig 16. Intercept points versus V ENCH1 (pin 2) OUT1 (pin 100 MHz at 6 dBm Fig 18. Switching speed SA58643_1 Product data sheet 002aab708 NF (dB) 5.0 6.0 V (V) DD Fig 17. Noise Figure versus frequency and V DD ...
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... NXP Semiconductors 13. Application information 13.1 Evaluation demo board The typical applications schematic and printed-circuit board layout of the SA58643 evaluation board is shown in cautions need to be observed. The input and output traces should The placement of the AC bypass capacitor is extremely critical if a symmetric isolation between the two channels is desired ...
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... NXP Semiconductors The SA58643DP evaluation demo board (see provides a stable RF layout. The demo circuit (see schematic) is constructed on 2-layer, 1-ounce copper, FR4 PCB material. The overall thickness is 0.062 inches and has a dielectric constant, are modeled for coplanar waveguide with both top and bottom ground. The 50 transmission line width is 1 ...
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... NXP Semiconductors Fig 20. A typical TDMA/digital RF transceiver system front-end oscillator Fig 21. Amplitude Shift Keying (ASK) Fig 23. Cascaded configuration SA58643_1 Product data sheet 5200 SA58643 TX/RX 5200 ASK output SA58643 50 enable CH1 TTL data 002aab694 generator IN/OUT SA58643 enable Rev. 01 — 20 November 2006 ...
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... NXP Semiconductors 14. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.05 0.80 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors 15. Soldering This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 15.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...
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... NXP Semiconductors 15.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...
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... NXP Semiconductors Fig 25. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 16. Abbreviations Table 9. Acronym ASK BiCMOS CMOS DC ESD FSK OOK PIN RF SMA TTL 17. Revision history Table 10 ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 7 Equivalent circuit . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 4 12 Performance curves . . . . . . . . . . . . . . . . . . . . . 5 13 Application information ...