T555711-DDW Atmel, T555711-DDW Datasheet - Page 30
![no-image](/images/manufacturer_photos/0/0/78/atmel_sml.jpg)
T555711-DDW
Manufacturer Part Number
T555711-DDW
Description
IC IDIC R/W RFID 330BIT ON-CHIP
Manufacturer
Atmel
Series
T555711r
Datasheet
1.T555711-TAS.pdf
(34 pages)
Specifications of T555711-DDW
Rf Type
Read / Write
Frequency
125kHz
Features
330-bit EEPROM
Package / Case
DICE
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
10.1
Figure 10-5. NOA2 Micromodule
30
Failed Die Identification
T5557
Note:
1. Reject hole by device testing
2. Punching cutline
3. Total package thickness
4. Module dimension
Drawing refers to following types: Micromodule
Drawing-No.: 6.549-5034.01-4
Issue: prel.; 25.09.02
Subcontractor: NedCard
recommendation for singulation
excludes punching burr
after galvanic seperation
Dimensions in mm
technical drawings
according to DIN
specifications
Every die on the wafer not passing Atmel test sequence is marked with inch.
The inch dot specification:
• Dot size: 200 µm
• Position: center of die
• Color: black
1.42
4.75
±0.05
+0.02
X5:1
9.5
X
±0.03
0.03
A
2.375
5.15
5.06
B
4.8
Note 2
Note 4
±0.05
A
±0.03
±0.03
4.625
R1.5
2.375
∅ 2
Note 1
B
±0.03
±0.05
0.03 A
R1.1
±0.03
31.83
25.565
21.815
15.915
12.165
6.265
2.515
0
1.585
R0.2 max.
0.38
0.09
Note 3
(4x)
-0.04
-0.01
4517J–RFID–03/06