T555711-DDW Atmel, T555711-DDW Datasheet - Page 30

• Manufacturer Part Number: T555711-DDW
• Description: IC IDIC R/W RFID 330BIT ON-CHIP
• Manufacturer: Atmel
• Series: T555711r

Specifications of T555711-DDW

• Rf Type: Read / Write
• Frequency: 125kHz
• Features: 330-bit EEPROM
• Package / Case: DICE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

10.1
Figure 10-5. NOA2 Micromodule
30
Failed Die Identification
T5557
Note:
1. Reject hole by device testing
2. Punching cutline
3. Total package thickness
4. Module dimension
Drawing refers to following types: Micromodule
Drawing-No.: 6.549-5034.01-4
Issue: prel.; 25.09.02
Subcontractor: NedCard
recommendation for singulation
excludes punching burr
after galvanic seperation
Dimensions in mm
technical drawings
according to DIN
specifications
Every die on the wafer not passing Atmel test sequence is marked with inch.
The inch dot specification:
• Dot size: 200 µm
• Position: center of die
• Color: black
1.42
4.75
±0.05
+0.02
X5:1
9.5
X
±0.03
0.03
A
2.375
5.15
5.06
B
4.8
Note 2
Note 4
±0.05
A
±0.03
±0.03
4.625
R1.5
2.375
∅ 2
Note 1
B
±0.03
±0.05
0.03 A
R1.1
±0.03
31.83
25.565
21.815
15.915
12.165
6.265
2.515
0
1.585
R0.2 max.
0.38
0.09
Note 3
(4x)
-0.04
-0.01
4517J–RFID–03/06