HSDL-9100-024 Avago Technologies US Inc., HSDL-9100-024 Datasheet - Page 10

• Manufacturer Part Number: HSDL-9100-024
• Description: IC PROX SENSOR ANLG OUT REFL SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-9100-024

• Sensing Distance: 0.197" (5mm)
• Sensing Method: Reflective
• Current - Collector (ic) (max): 100mA
• Current - Dc Forward (if): 100mA
• Output Type: Analog
• Response Time: 6µs, 6µs
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Operating Temperature: -40°C ~ 85°C
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Proximity Sensor Type: Optical
• Proximity Sensor Sensing Distance: 5mm
• Proximity Sensor Sensing Distance Range: 2 to 7mm
• Mounting: Surface Mount
• Package Type: SMD
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Pin Count: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Collector Emitter Breakdown (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A: HSDL-9100 SMT Assembly Application Note
Recommended Metal solder Stencil Aperture
It is recommended that only a 0.152 mm (0.006 inch) or
a 0.127 mm (0.005 inch) thick stencil be used for solder
paste printing. This is to ensure adequate printed solder
paste volume and no shorting. See Table 1 below the
drawing for combinations of metal stencil aperture and
metal stencil thickness that should be used. Aperture
opening for shield pad is 3.05 mm x 1.1 mm as per land
pattern.
Table 1. Combinations of metal stencil aperture and metal
stencil thickness
Adjacent Land Keep out and Solder Mask Areas
Adjacent land keep out is the maximum space occupied
by the unit relative to the land pattern. There should be
no other SMD components within this area. The minimum
solder resist strip width required to avoid solder bridging
adjacent pads is 0.2mm.It is recommended that two
fiducial crosses be placed at mid length of the pads for
unit alignment. Also do take note that there should not
be any electrical routing with the component placement
compartment.
Note:
Solder Pad, Mask and Metal Stencil
Figure 9. Stencil and PCBA
10
Stencil
thickness,
t (mm)
0.152
0.127
Wet/Liquid Photo-imaginable solder resist/mask is recommended
Solder Mask
Stencil Aperture
Metal stencil for
solder paste printing
1.60+/-0.05
Length,
1.92
l
Aperture size (mm)
PCBA
0.55+/-0.05
0.55+/-0.05
Width,
w
Land Pattern
Recommended land pattern
Figure 11. Solder stencil aperture
Solder / stencil opening for each pad is 2.4mm x0.6mm
Figure 10. Land Pattern
Figure 12. Keep-out area
Dim.
h
Solder Mask
k
l
j
Apertures as per
Land Dimensions
2.1
k
j
4.15
mm
5.5
3.5
11
w
l
7.7
7.1
Mounting Center
Component placement
2.4
l
h
t