HSDL-9100-024 Avago Technologies US Inc., HSDL-9100-024 Datasheet - Page 9

• Manufacturer Part Number: HSDL-9100-024
• Description: IC PROX SENSOR ANLG OUT REFL SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-9100-024

• Sensing Distance: 0.197" (5mm)
• Sensing Method: Reflective
• Current - Collector (ic) (max): 100mA
• Current - Dc Forward (if): 100mA
• Output Type: Analog
• Response Time: 6µs, 6µs
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Operating Temperature: -40°C ~ 85°C
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Proximity Sensor Type: Optical
• Proximity Sensor Sensing Distance: 5mm
• Proximity Sensor Sensing Distance Range: 2 to 7mm
• Mounting: Surface Mount
• Package Type: SMD
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Pin Count: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Collector Emitter Breakdown (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Recommended Reflow Profile
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different 'T/'time tem-
perature change rates or duration. The 'T/'time rates or
duration are detailed in the above table. The tempera-
tures are measured at the component to printed circuit
board connections.
In process zone P1
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is
limited to 3°C per second to allow for even heating of
both the PC board and component pins.
Process zone P2
to 180 seconds) to dry the solder paste. The temperature
is raised to a level just below the liquidus point of the
solder.
9
150
120
255
230
217
200
180
80
25
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
Time maintained above liquidus point , 217°C
Peak Temperature
Time within 5°C of actual Peak Temperature
Time 25°C to Peak Temperature
0
should be of sufficient time duration (100
R1
, the PC board and component pins are
HEAT
UP
P1
50
R2
SOLDER PASTE DRY
100
P2
Symbol
P2, R2
P3, R3
P3, R4
P4, R5
P1, R1
150
Process zone P3
temperature is quickly raised above the liquidus point
of solder to 260°C (500°F) for optimum results. The
dwell time above the liquidus point of solder should be
between 60 and 120 seconds. This is to assure proper
coalescing of the solder paste into liquid solder and the
formation of good solder connections. Beyond the rec-
ommended dwell time the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below
the solidus temperature of the solder to allow the solder
within the connections to freeze solid.
Process zone P4
The cool down rate, R5, from the liquidus point of the
solder to 25°C (77°F) should not exceed 6°C per second
maximum. This limitation is necessary to allow the PC
board and component pins to change dimensions evenly,
putting minimal stresses on the component.
It is recommended to perform reflow soldering no more
than twice.
150°C to 200°C
200°C to 260°C
260°C to 200°C
25°C to 150°C
200°C to 25°C
25°C to 260°C
R3
60 sec to 120 sec
> 217°C
> 255°C
Above 217°C
260°C
MAX 260°C
'T
200
REFLOW
SOLDER
P3
is the solder reflow zone. In zone P3, the
R4
is the cool down after solder freeze.
COOL DOWN
250
Maximum 'T/'time
P4
R5
100s to 180s
60s to 120s
or Duration
20s to 40s
8mins
-6°C/s
-6°C/s
3°C/s
3°C/s
-
(SECONDS)
t-TIME
300