HSDL-9100-024 Avago Technologies US Inc., HSDL-9100-024 Datasheet - Page 8

• Manufacturer Part Number: HSDL-9100-024
• Description: IC PROX SENSOR ANLG OUT REFL SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HSDL-9100-024

• Sensing Distance: 0.197" (5mm)
• Sensing Method: Reflective
• Current - Collector (ic) (max): 100mA
• Current - Dc Forward (if): 100mA
• Output Type: Analog
• Response Time: 6µs, 6µs
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Operating Temperature: -40°C ~ 85°C
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Proximity Sensor Type: Optical
• Proximity Sensor Sensing Distance: 5mm
• Proximity Sensor Sensing Distance Range: 2 to 7mm
• Mounting: Surface Mount
• Package Type: SMD
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Pin Count: 4
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Collector Emitter Breakdown (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

HSDL-9100 Moisture Proof Packaging
All HSDL-9100 options are shipped in moisture proof
package. Once opened, moisture absorption begins.
This part is compliant to JEDEC Level 3.
Baking Conditions
If the parts are not stored in dry conditions, they must
be baked before reflow to prevent damage to the parts.
Baking should only be done once.
Recommended Storage Conditions
Time from unsealing to soldering
After removal from the bag, the parts should be soldered
within seven days if stored at the recommended storage
conditions.
8
Package
In reels
In bulk
Storage Temperature
Relative Humidity
100 °C
125 °C
Temp
60 °C
10°C to 30°C
below 60% RH
t
t
t
48hours
2 hours
Time
4hours
Baking Conditions Chart
Figure 7. Baking conditions chart
Is Necessary
No Baking
Yes
Perform Recommended
Opened (Unsealed)
Baking Conditions
Units in A Sealed
less than 30 deg C,
Moisture-Proof
Than 168 hours
Environment
and less than
Package Is
Opened less
Package Is
Package
60% RH
No
Yes
No