IRLHS6276TRPBF International Rectifier, IRLHS6276TRPBF Datasheet - Page 2

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IRLHS6276TRPBF

Manufacturer Part Number
IRLHS6276TRPBF
Description
MOSFET 2N-CH 20V 4.5A PQFN
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRLHS6276TRPBF

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
45 mOhm @ 3.4A, 4.5V
Drain To Source Voltage (vdss)
20V
Current - Continuous Drain (id) @ 25° C
4.5A
Vgs(th) (max) @ Id
1.1V @ 10µA
Gate Charge (qg) @ Vgs
3.1nC @ 4.5V
Input Capacitance (ciss) @ Vds
310pF @ 10V
Power - Max
1.5W
Mounting Type
Surface Mount
Package / Case
*
Configuration
Dual
Transistor Polarity
Dual N-Channel
Resistance Drain-source Rds (on)
45 mOhms
Drain-source Breakdown Voltage
20 V
Gate-source Breakdown Voltage
12 V
Continuous Drain Current
4.5 A
Power Dissipation
1.5 W
Gate Charge Qg
3.1 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRLHS6276TRPBF
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRLHS6276TRPBF
0
Company:
Part Number:
IRLHS6276TRPBF
Quantity:
8 000

ƒ
IRLHS6276PbF
BV
∆ΒV
R
V
∆V
I
I
gfs
Q
Q
Q
R
t
t
t
t
C
C
C
I
I
V
t
Q
t
R
R
R
R
Static @ T
Diode Characteristics
Thermal Resistance
DSS
GSS
d(on)
r
d(off)
f
S
SM
rr
on
GS(th)
SD
DS(on)
G
iss
oss
rss
g
gs
gd
rr
θJC
θJC
θJA
θJA
R
Repetitive rating; pulse width limited by max. junction temperature.
Current limited by package.
Pulse width ≤ 400µs; duty cycle ≤ 2%.
When mounted on 1 inch square copper board.
For DESIGN AID ONLY, not subject to production testing.
2
GS(th)
DSS
θ
DSS
(<10s)
is measured at
(Bottom)
(Top)
/∆T
J
J
= 25°C (unless otherwise specified)
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Gate Threshold Voltage Coefficient
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Forward Transconductance
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
J
Parameter
Junction-to-Case
Junction-to-Case
Junction-to-Ambient
Junction-to-Ambient
Ù
Parameter
f
f
Parameter
Time is dominated by parasitic Inductance
Min.
Min.
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
0.5
8.8
20
Typ. Max. Units
Typ. Max. Units
0.22
–––
-3.8
–––
–––
–––
–––
–––
310
–––
–––
–––
9.3
0.8
3.1
1.3
4.0
4.4
9.3
4.9
5.2
5.0
33
46
10
79
49
9.6
-100
–––
–––
–––
150
100
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
1.1
1.0
1.2
7.8
7.5
45
62
40
d
mV/°C
mV/°C
mΩ
µA
nA
nC
pF
nC
ns
ns
A
V
V
S
V
Typ.
–––
–––
–––
–––
V
Reference to 25°C, I
V
V
V
V
V
V
V
V
V
V
I
V
ID = 3.4A
R
See Fig.15
V
V
ƒ = 1.0MHz
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 126A/µs
D
J
J
GS
GS
GS
DS
DS
DS
GS
GS
DS
DS
GS
DD
G
GS
DS
= 3.4A
=1.8Ω
= 25°C, I
= 25°C, I
= V
= 16V, V
= 16V, V
= 10V, I
= 10V
= 10V
= 0V, I
= 4.5V, I
= 2.5V, I
= 12V
= -12V
= 4.5V
= 10V, V
= 0V
GS
d
d
, I
D
(See Fig.17 & 18)
D
S
F
D
= 250µA
D
D
GS
GS
GS
Conditions
Conditions
= 10µA
= 3.4A
= 3.4A
= 3.4A
Max.
= 3.4A
= 3.4A
175
= 0V
= 0V, T
= 4.5V
19
86
69
d
d
D
d
ed
ed
= 1mA
, V
, V
www.irf.com
J
= 125°C
DD
GS
G
= 10V
= 0V
Units
°C/W
e
D
S

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