EFM32G890F64 Energy Micro, EFM32G890F64 Datasheet - Page 67

• Manufacturer Part Number: EFM32G890F64
• Description: MCU 32BIT 64KB FLASH 112-BGA
• Manufacturer: Energy Micro
• Series: Geckor

Specifications of EFM32G890F64

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: EBI/EMI, I²C, IrDA, SmartCard, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
• Number Of I /o: 90
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.8 V
• Data Converters: A/D 8x12b, D/A 2x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LFBGA
• Processor Series: EFM32G890
• Core: ARM Cortex-M3
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, UART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 90
• Number Of Timers: 3
• Operating Supply Voltage: 1.8 V to 3.8 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

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List of Figures
1.1. Block Diagram ....................................................................................................................................... 2
2.1. EFM32G890 Memory Map with largest RAM and Flash sizes .......................................................................... 8
3.1. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
28MHz ..................................................................................................................................................... 12
3.2. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
21MHz ..................................................................................................................................................... 12
3.3. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
14MHz ..................................................................................................................................................... 13
3.4. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
11MHz ..................................................................................................................................................... 13
3.5. EM0 Current consumption while executing prime number calculation code from flash with HFRCO running at
7MHz ....................................................................................................................................................... 14
3.6. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 28MHz ............................... 14
3.7. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 21MHz ............................... 15
3.8. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 14MHz ............................... 15
3.9. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 11MHz ............................... 16
3.10. EM1 Current consumption with all peripheral clocks disabled and HFRCO running at 7MHz ............................... 16
3.11. EM2 current consumption. RTC prescaled to 1kHz, 32 kHz LFRCO. ............................................................. 17
3.12. EM3 current consumption. ................................................................................................................... 17
3.13. EM4 current consumption. ................................................................................................................... 18
3.14. Typical Low-Level Output Current, 2V Supply Voltage ................................................................................ 21
3.15. Typical High-Level Output Current, 2V Supply Voltage ................................................................................ 22
3.16. Typical Low-Level Output Current, 3V Supply Voltage ................................................................................ 23
3.17. Typical High-Level Output Current, 3V Supply Voltage ................................................................................ 24
3.18. Typical Low-Level Output Current, 3.8V Supply Voltage .............................................................................. 25
3.19. Typical High-Level Output Current, 3.8V Supply Voltage ............................................................................. 26
3.20. Calibrated LFRCO Frequency vs Temperature and Supply Voltage .............................................................. 28
3.21. Calibrated HFRCO 1 MHz Band Frequency vs Temperature and Supply Voltage ............................................ 30
3.22. Calibrated HFRCO 7 MHz Band Frequency vs Temperature and Supply Voltage ............................................ 30
3.23. Calibrated HFRCO 11 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 30
3.24. Calibrated HFRCO 14 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.25. Calibrated HFRCO 21 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.26. Calibrated HFRCO 28 MHz Band Frequency vs Temperature and Supply Voltage ........................................... 31
3.27. Integral Non-Linearity (INL) ................................................................................................................... 36
3.28. Differential Non-Linearity (DNL) .............................................................................................................. 36
3.29. ADC Frequency Spectrum, Vdd = 3V, Temp = 25° ................................................................................... 37
3.30. ADC Integral Linearity Error vs Code, Vdd = 3V, Temp = 25° ..................................................................... 38
3.31. ADC Differental Linearity Error vs Code, Vdd = 3V, Temp = 25° .................................................................. 39
3.32. ADC Absolute Offset, Common Mode = Vdd /2 ........................................................................................ 40
3.33. ADC Dynamic Performance vs Temperature for all ADC References, Vdd = 3V .............................................. 40
3.34. ADC Temperature sensor readout ......................................................................................................... 41
3.35. Typical ACMP Characteristics ............................................................................................................... 44
4.1. EFM32G890 Pinout (top view, not to scale) ............................................................................................... 48
4.2. BGA112 .............................................................................................................................................. 56
5.1. BGA112 PCB Land Pattern ..................................................................................................................... 58
5.2. BGA112 PCB Solder Mask ..................................................................................................................... 58
5.3. BGA112 PCB Stencil Design ................................................................................................................... 59
6.1. Example Chip Marking ........................................................................................................................... 60
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2010-12-17 - d0010_Rev1.20
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