PK30X256VMD100 Freescale Semiconductor, PK30X256VMD100 Datasheet - Page 9
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
PK30X256VMD100
Manufacturer Part Number
PK30X256VMD100
Description
IC ARM CORTEX MCU 256K 144-MAP
Manufacturer
Freescale Semiconductor
Series
Kinetisr
Specifications of PK30X256VMD100
Core Processor
ARM Cortex-M4
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SDHC, SPI, UART/USART
Peripherals
DMA, I²S, LCD, LVD, POR, PWM, WDT
Number Of I /o
102
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
1.71 V ~ 3.6 V
Data Converters
A/D 37x16b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LBGA
Rohs Compliant
Yes
Processor Series
Kinetis
Core
ARM Cortex M4
Data Ram Size
64 KB
Interface Type
UART, SPI, I2C, I2S, CAN
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
102
Operating Supply Voltage
1.71 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PK30X256VMD100
Manufacturer:
FSL
Quantity:
10
Company:
Part Number:
PK30X256VMD100
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
4.1 Thermal handling ratings
1. Determined according to JEDEC Standard JESD22-A103, High Temperature Storage Life.
2. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
4.2 Moisture handling ratings
1. Determined according to IPC/JEDEC Standard J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic
4.3 ESD handling ratings
1. Determined according to JEDEC Standard JESD22-A114, Electrostatic Discharge (ESD) Sensitivity Testing Human Body
2. Determined according to JEDEC Standard JESD22-C101, Field-Induced Charged-Device Model Test Method for
4.4 Voltage and current operating ratings
Freescale Semiconductor, Inc.
Symbol
Symbol
Symbol
Solid State Surface Mount Devices.
Solid State Surface Mount Devices.
Model (HBM).
Electrostatic-Discharge-Withstand Thresholds of Microelectronic Components.
Symbol
V
V
T
T
MSL
I
V
LAT
STG
SDR
HBM
CDM
V
I
DD
DIO
DD
Storage temperature
Solder temperature, lead-free
Solder temperature, leaded
Moisture sensitivity level
Electrostatic discharge voltage, human body model
Electrostatic discharge voltage, charged-device model
Latch-up current at ambient temperature of 105°C
Description
Description
Description
Digital supply voltage
Digital supply current
Digital input voltage (except RESET, EXTAL, and XTAL)
Description
K30 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Table continues on the next page...
Preliminary
-2000
-500
-100
Min.
Min.
Min.
–55
—
—
—
–0.3
–0.3
Min.
—
+2000
+500
+100
Max.
Max.
Max.
150
260
245
3
Max.
185
3.8
5.5
Unit
Unit
Unit
mA
°C
°C
—
V
V
Notes
Notes
Notes
Unit
mA
V
V
Ratings
1
2
1
1
2
9