MCIMX27MOP4A Freescale Semiconductor, MCIMX27MOP4A Datasheet - Page 130

• Manufacturer Part Number: MCIMX27MOP4A
• Description: IC MPU I.MX27 19X19 473MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: i.MX27r

Specifications of MCIMX27MOP4A

• Core Processor: ARM9
• Core Size: 32-Bit
• Speed: 400MHz
• Connectivity: 1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
• Peripherals: DMA, LCD, POR, PWM, WDT
• Program Memory Type: ROMless
• Ram Size: 45K x 8
• Voltage - Supply (vcc/vdd): 1.38 V ~ 1.52 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 473-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of I /o: -
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Package Information and Pinout
5.4
Table 61
Table 62
these pins depend solely upon the user application, however there are a few factory test signals that are
not used in a normal application. Following is a list of these signals and how they are to be terminated for
proper operation of the i.MX27/MX27L processor:
130
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CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
EXT_60M: To ensure proper operation, connect this signal to ground.
EXT_266M: To ensure proper operation, connect this signal to ground.
Most of the signals shown in
of the signals at a particular pad are shown in the form of a compound signal name. Refer to
for complete information on the signal multiplexing schemes of these signals.
shows the i.MX27 full 19 × 19 mm package MAPBGA pin assignment.
identifies the pin assignments for the ball grid array (BGA) for full package. The connections of
Pin Assignments (19 mm × 19 mm)
i.MX27 and i.MX27L Data Sheet, Rev. 1.6
Table 62
are multiplexed with other signals. For ease of reference, all
Freescale Semiconductor
Table 3