MCIMX257CVM4 Freescale Semiconductor, MCIMX257CVM4 Datasheet - Page 41
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MCIMX257CVM4
Manufacturer Part Number
MCIMX257CVM4
Description
IC MPU I.MX25 IND 400MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX25r
Datasheet
1.MCIMX257CJM4.pdf
(154 pages)
Specifications of MCIMX257CVM4
Core Processor
ARM9
Core Size
32-Bit
Speed
400MHz
Connectivity
1-Wire, CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
External Program Memory
Ram Size
144K x 8
Voltage - Supply (vcc/vdd)
1.15 V ~ 1.52 V
Data Converters
A/D 3x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
400-LFBGA
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCIMX257CVM4
Manufacturer:
TOTO
Quantity:
83
Company:
Part Number:
MCIMX257CVM4
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Note:
1. Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1. V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
2. Minimum condition for tps: wcs model, 1.1 V, I/O 1.7 V, and 105 °C. tps is measured between VIL to VIH for rising edge and
3. Maximum condition for tdit: bcs model, 1.3 V, I/O 1.9 V, and –40 °C.
4. Maximum condition for tpi and trfi: wcs model, 1.1 V, I/O 1.7 V and 105 °C. Minimum condition for tpi and trfi: bcs model, 1.3 V,
Table 30
Note:
1. Maximum condition for tpr, tpo, tpi, and tpv: wcs model, 1.1 V, I/O 1. V, and 105 °C. Minimum condition for tpr, tpo, and tpv: bcs
Freescale Semiconductor
Duty cycle
Clock frequency
Output pad transition times
Output pad propagation delay, 50%–50%
input signals and crossing of output signals
Output pad propagation delay, 40%–60%
input signals and crossing of output signals
Output enable to output valid delay,
50%–50%
Output enable to output valid delay,
40%–60%
Output pad slew rate
Output pad dI/dt
Input pad transition times
Input pad propagation delay, 50%–50%
Input pad propagation delay, 40%–60%
Output pad dI/dt
Input pad transition times
Input pad propagation delay, 50%–50%
Input pad propagation delay, 40%–60%
model, 1.3 V, I/O 1.9 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
between VIH to VIL for falling edge.
I/O 1.9 V and –40 °C. Input transition time from pad is 5 ns (20%–80%).
model, 1.3 V, I/O 1.9 V and –40 °C. Input transition time from core is 1 ns (20%–80%).
shows AC parameters for DDR2 pbijtov18_33_ddr_clk I/O.
Parameter
Parameter
i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 8
Table 30. AC Parameters for DDR2 pbijtov18_33_ddr_clk I/O
Table 29. AC Parameters for DDR2 I/O (continued)
Symbol
Symbol
Fduty
tpo
tpo
tpv
tpv
tps
tdit
tdit
tpr
trfi
trfi
tpi
tpi
tpi
tpi
f
Condition
Condition
1.0 pF
1.0 pF
1.0 pF
1.0 pF
1.0 pF
1.0 pF
25 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
25 pF
50 pF
50 pF
50 pF
25 pF
Load
Load
—
—
Rise/Fall
0.07/0.08 0.10/0.12 0.17/0.20
0.83/0.99 1.23/1.49 1.79/2.04
1.65/1.81 2.05/2.31 2.60/2.84
0.53/0.52
1.01/0.98
1.47/1.38
1.75/1.67
1.32/1.28
1.66/1.65
1.40/1.37
1.67/1.66
0.86/0.98
0.07/0.08 0.10/0.12
0.89/0.87 1.41/1.37
1.71/1.69 2.22/2.18
Rise/Fall
0.46/054
1.3/1.21
1.59/1.5
Min.
Min.
65
70
40
72
77
—
0.80/0.72
1.49/1.34
1.97/1.84
2.37/2.24
2.13/2.00
2.54/2.40
2.11/2.00
2.61/2.50
2.16/2.06
2.56/2.45
0.72/0.81
1.35/1.5
Typ.
Typ.
157
167
172
183
50
—
Rise/Fall
3.072/2.87
1.19/1.04
2.21/1.90
2.91/2.71
3.48/3.28
3.65/3.45
3.31/3.12
4.06/3.81
3.30/3.13
3.89/3.67
2.15/2.19
1.12/1.16
0.17/0.20
2.16/2.07
2.98/2.88
Rise/Fall
Max.
373
396
Max.
133
400
422
60
mA/ns
Units
mA/ns
Units
ns
ns
ns
MHz
V/ns
ns
ns
ns
ns
ns
ns
ns
ns
%
Notes
Notes
3
4
—
—
1
1
1
1
1
2
3
4
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