APDS-9702-020 Avago Technologies US Inc., APDS-9702-020 Datasheet - Page 16

• Manufacturer Part Number: APDS-9702-020
• Description: Photodiodes Sigl Conditioning IC f/ Opt Proximity Sen
• Manufacturer: Avago Technologies US Inc.
• Type: Signal Conditioning IC for Optical Proximity Sensorsr

Specifications of APDS-9702-020

• Package / Case: QFN-8
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Product: Ambient Light Sensor
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Recommended Reflow Profile
The reflow profile is a straight-line representation of
a nominal temperature profile for a convective reflow
solder process. The temperature profile is divided into
four process zones, each with different 'T/'time tem-
perature change rates or duration. The 'T/'time rates or
duration are detailed in the above table. The temperatures
are measured at the component to printed circuit board
connections.
In
heated to a temperature of 150°C to activate the flux in
the solder paste. The temperature ramp up rate, R1, is
limited to 3°C per second to allow for even heating of both
the PC board and APDS-9702 pins.
Process zone P2
to 180 seconds) to dry the solder paste. The temperature is
raised to a level just below the liquidus point of the solder,
usually 200°C (392°F).
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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-2238EN - March 3, 2010
process zone P1
230
217
200
180
150
120
255
80
25
0
should be of sufficient time duration (100
HEAT
R1
, the PC board and APDS-9702 pins are
P1
UP
50
R2
SOLDER PASTE DRY
100
P2
150
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Process zone P3
temperature is quickly raised above the liquidus point of
solder to 255°C (491°F) for optimum results. The dwell time
above the liquidus point of solder should be between 20
and 40 seconds. It usually takes about 20 seconds to assure
proper coalescing of the solder balls into liquid solder
and the formation of good solder connections. Beyond a
dwell time of 40 seconds, the intermetallic growth within
the solder connections becomes excessive, resulting in
the formation of weak and unreliable connections. The
temperature is then rapidly reduced to a point below the
solidus temperature of the solder, usually 200°C (392°F), to
allow the solder within the connections to freeze solid.
Process zone P4
cool down rate, R5, from the liquidus point of the solder to
25°C (77°F) should not exceed 6°C per second maximum.
This limitation is necessary to allow the PC board and
APDS-9702 pins to change dimensions evenly, putting
minimal stresses on the APDS-9702.
It is recommended to perform reflow soldering no more
than twice.
R3
60 sec to 90 sec
Above 217 C
MAX 260C
200
REFLOW
SOLDER
P3
R4
is the solder reflow zone. In zone P3, the
is the cool down after solder freeze. The
COOL DOWN
250
P4
R5
(SECONDS)
t-TIME
300