MPC8536EAVTAVL Freescale Semiconductor, MPC8536EAVTAVL Datasheet - Page 112
MPC8536EAVTAVL
Manufacturer Part Number
MPC8536EAVTAVL
Description
Microprocessors (MPU) PQ38S 8536 SQUID
Manufacturer
Freescale Semiconductor
Datasheet
1.MPC8536EBVTAQG.pdf
(126 pages)
Specifications of MPC8536EAVTAVL
Processor Series
MPC85xx
Core
e500
Data Bus Width
32 bit
Maximum Clock Frequency
1500 MHz
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 90 C
Mounting Style
SMD/SMT
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
0 C
Package / Case
FCPBGA-783
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
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Quantity
Price
Company:
Part Number:
MPC8536EAVTAVLA
Manufacturer:
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Thermal
The recommended attachment method to the heat sink is illustrated in
printed-circuit board with the spring force centered over the die. This spring force should not exceed 10 pounds force (45
Newton).
The system board designer can choose between several types of heat sinks to place on the device. Ultimately, the final selection
of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass,
attachment method, assembly, and cost. Several heat sinks offered by Aavid Thermalloy, Advanced Thermal Solutions, Alpha
Novatech, IERC, Chip Coolers, Millennium Electronics, and Wakefield Engineering offer different heat sink-to-ambient
thermal resistances, that will allow the MPC8535E to function in various environments.
2.24.3.1
For the packaging technology, shown in
Figure 74
112
•
•
The die junction-to-case thermal resistance
The die junction-to-board thermal resistance
depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board.
Figure 73. Package Exploded Cross-Sectional View with Several Heat Sink Options
Internal Package Conduction Resistance
(Note the internal versus external package resistance)
External Resistance
External Resistance
MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3
Internal Resistance
Figure 74. Package with Heat Sink Mounted to a Printed-Circuit Board
Thermal Interface Material
Printed-Circuit Board
Printed-Circuit Board
Table
Heat Sink
Heat Sink
Heat Sink
70, the intrinsic internal conduction thermal resistance paths are as follows:
Clip
Die
Radiation
Radiation
Convection
Convection
Figure
FC-PBGA Package
73. The heat sink should be attached to the
Thermal Interface Material
Die/Package
Die Junction
Package/Solder Spheres
Freescale Semiconductor
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