A2F200M3F-1FGG484 Actel, A2F200M3F-1FGG484 Datasheet - Page 36

• Manufacturer Part Number: A2F200M3F-1FGG484
• Description: FPGA - Field Programmable Gate Array 200K System Gates SmartFusion
• Manufacturer: Actel

Specifications of A2F200M3F-1FGG484

• Processor Series: A2F200
• Core: ARM Cortex M3
• Number Of Logic Blocks: 8
• Maximum Operating Frequency: 120 MHz
• Number Of Programmable I/os: 161
• Data Ram Size: 4608 bit
• Delay Time: 200 ns
• Supply Voltage (max): 3.6 V
• Supply Current: 1 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: 0 C
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: A2F-Eval-Kit, A2F-Dev-Kit, FlashPro 3, FlashPro Lite, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 200000
• Package / Case: FPBGA-484
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SmartFusion DC and Switching Characteristics
2- 24
Table 2-20 • Summary of Maximum and Minimum DC Input Levels
Summary of I/O Timing Characteristics – Default I/O Software
Settings
Table 2-21 • Summary of AC Measuring Points Applicable to All I/O Bank Types
Table 2-22 • I/O AC Parameter Definitions
DC I/O Standards
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI
3.3 V PCI-X
Standard
3.3 V LVTTL / 3.3 V LVCMOS
2.5 V LVCMOS
1.8 V LVCMOS
1.5 V LVCMOS
3.3 V PCI
3.3 V PCI-X
LVDS
LVPECL
Parameter
t
t
t
t
t
t
t
t
t
t
t
DP
PY
DOUT
EOUT
DIN
HZ
ZH
LZ
ZL
ZHS
ZLS
Applicable to Commercial Conditions in all I/O Bank Types
Data to pad delay through the output buffer
Pad to data delay through the input buffer
Data to output buffer delay through the I/O interface
Enable to output buffer tristate control delay through the I/O interface
Input buffer to data delay through the I/O interface
Enable to pad delay through the output buffer—High to Z
Enable to pad delay through the output buffer—Z to High
Enable to pad delay through the output buffer—Low to Z
Enable to pad delay through the output buffer—Z to Low
Enable to pad delay through the output buffer with delayed enable—Z to High
Enable to pad delay through the output buffer with delayed enable—Z to Low
R e visio n 6
Parameter Definition
Measuring Trip Point (V
0.285 * VCCxxxxIOBx (RR)
0.285 * VCCxxxxIOBx (RR)
0.615 * VCCxxxxIOBx (FF)
0.615 * VCCxxxxIOBx (FF)
µA
15
15
15
15
15
15
I
IL
Cross point
Cross point
0.90 V
0.75 V
1.4 V
1.2 V
Commercial
trip
)
µA
I
15
15
15
15
15
15
IH