AGLP030V5-CSG289 Actel, AGLP030V5-CSG289 Datasheet - Page 20

• Manufacturer Part Number: AGLP030V5-CSG289
• Description: FPGA - Field Programmable Gate Array 30K System Gates
• Manufacturer: Actel

Specifications of AGLP030V5-CSG289

• Processor Series: AGLP030
• Core: IP Core
• Number Of Macrocells: 256
• Maximum Operating Frequency: 250 MHz
• Number Of Programmable I/os: 4
• Data Ram Size: 4608 bit
• Supply Voltage (max): 1.575 V
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Development Tools By Supplier: AGLP-Eval-Kit, AGL-Dev-Kit-SCS, Silicon-Explorer II, Silicon-Sculptor 3, SI-EX-TCA, Flashpro 4, Flashpro 3, Flashpro Lite
• Mounting Style: SMD/SMT
• Supply Voltage (min): 1.425 V
• Number Of Gates: 30 K
• Package / Case: CSP-289
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

IGLOO PLUS DC and Switching Characteristics
Table 2-5 • Package Thermal Resistivities
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays (normalized to T
2- 6
Package Type
Chip Scale Package (CSP)
Very Thin Quad Flat Package (VQFP)
Array Voltage
VCC (V)
1.425
1.5
1.575
Maximum Power Allowed
V
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1
where:
T
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
θ
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is θ
θ
temperature is 100°C.
allowed for a 484-pin FBGA package at commercial temperature and in still air.
Temperature and Voltage Derating Factors
CC
A
ja
ja
. The thermal characteristics for θ
= Ambient temperature
= Junction-to-ambient of the package. θ
T
= 1.425 V)
J
can be used to calculate junction temperature.
= Junction Temperature = ΔT + T
–40°C
0.934
0.855
0.799
=
Max. junction temp. (°C) Max. ambient temp. (°C)
----------------------------------------------------------------------------------------------------------------------------------------- -
EQ 2
0.953
0.874
0.816
0°C
shows a sample calculation of the maximum operating power dissipation
ja
are shown for two air flow rates. The maximum operating junction
Count
A
128
Junction Temperature (°C)
Pin
201
281
289
176
θ
ja
0.971
0.891
0.832
25°C
ja
(°C/W)
R ev isio n 1 1
numbers are located in
–
TBD
TBD
TBD
TBD
TBD
θ
jc
jc
and the junction-to-ambient air thermal resistivity is
Still Air
1.000
0.917
0.857
70°C
TBD
TBD
TBD
TBD
TBD
Figure
200 ft./
min.
=
TBD
TBD
TBD
TBD
TBD
ja
θ
ja
* P
100°C 70°C
------------------------------------ -
2-5.
1.007
0.924
0.864
85°C
20.5°C/W
–
J
= 70°C,
500 ft./
min.
TBD
TBD
TBD
TBD
TBD
=
100°C
1.46 W
1.013
0.929
0.868
Units
C/W
C/W
C/W
C/W
C/W
EQ 1
EQ 2