LFXP3C-3TN144I Lattice, LFXP3C-3TN144I Datasheet - Page 279

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LFXP3C-3TN144I

Manufacturer Part Number
LFXP3C-3TN144I
Description
FPGA - Field Programmable Gate Array 3.1K LUTs 100 I/O 1.8/2.5/3.3V IND
Manufacturer
Lattice
Datasheets

Specifications of LFXP3C-3TN144I

Number Of Programmable I/os
100
Data Ram Size
55296
Supply Voltage (max)
3.465 V
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (min)
1.71 V
Package / Case
TQFP-144
Package
144TQFP
Family Name
LatticeXP
Device Logic Units
3000
Maximum Internal Frequency
320 MHz
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Maximum Number Of User I/os
100
Ram Bits
55296
Re-programmability Support
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LFXP3C-3TN144I
Manufacturer:
INTEL
Quantity:
1 143
Part Number:
LFXP3C-3TN144I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
Power Calculator Equations
The power equations used in the Power Calculator have the following general form:
Total DC Power (Resource)
Where:
The total DC power consumption for all the resources as per the design data is the sum of Quiescent Power and
the individual DC power of the resources in the Power Calculator.
Total DC Power (I
Where:
Typical Standby I
The AC power, on the other hand, is governed by the equation:
Total AC Power (Resource)
Where:
Based on the above equations, if we wish to calculate the power consumption of the Slice portion, it will be as fol-
lows:
Total DC Power (Slice)
Total AC Power (Slice)
The DC and AC power, for a dedicated block, like DSP in LatticeECP devices, is governed by the following equa-
tions.
Total DC Power (Resource)
= Total DC Power of Used Portion + Total DC Power of Unused Portion
= [DC Leakage per resource when Used * N
N
N
= K
KRESOURCE
I
= K
N
N
K
f
AF
= Total DC Power of Used Portion + Total DC Power of Unused Portion
= [DC Leakage per Slice when Used * N
= K
= DC Leakage per Resource * N
CCAUX
MAX
RESOURCE
TOTAL RESOURCE
RESOURCE
TOTAL RESOURCE
RESOURCE
+ [DC Leakage per resource when Unused * (N
+ [DC Leakage per Slice when Unused * (N
RESOURCE
RESOURCE
RESOURCE
SLICE
CCAUX
CCAUX
* f
MAX
* 500 µA + Typical Standby I
* f
)
is found in the data sheet.
* AF
MAX
SLICE
* AF
is the total number of resources in a device.
is the number of resources used in the design.
is the number of reference input I/O such as HSTL/SSTL. For LVDS KRE-
SOURCE is number of inputs divided by two.
is a DC current that does not change with I/O toggle rate or temperature.
is the total number of resources in a device.
is the number of resources used in the design.
is the power constant for the resource, measured in mW/MHz.
is the maximum frequency at which the resource is running, measured in MHz.
is the activity factor for the resource group, as a percentage (%) of switching 
frequency.
RESOURCE
* N
SLICE
RESOURCE
* N
RESOURCE
SLICE
CCAUX
RESOURCE
TOTAL SLICE
]
12-2
TOTAL RESOURCE
for LatticeECP/EC and LatticeXP Devices
]
- N
Power Estimation and Management
SLICE
)]
- N
RESOURCE
)]

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