BLM18HG601SN1D Murata, BLM18HG601SN1D Datasheet - Page 141

• Manufacturer Part Number: BLM18HG601SN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 600 OHM
• Manufacturer: Murata

Specifications of BLM18HG601SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 600 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 1 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 1ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• Inductor Case Style: 0603
• No. Of Pins: 2
• Core Material: Ferrite
• Resistance: 1ohm
• Rohs Compliant: Yes
• Operating Temperature Min: -55°C
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NF
!Note
1. Standard Land Pattern Dimensions
NFM18
NFL18
NFM55P
NFM21C
NFM21P
NFM3D
NFM31P
NFM41
NFR21G
NFL21S
NFp series suppress noise by conducting the high-frequency noise element to ground. Therefore, to obtain maximum
performance from these filters, the ground pattern should be made as large as possible during the PCB design stage. As
shown below, one side of the PCB is used for chip mounting, and the other is used for grounding.
Small diameter feedthrough holes are then used to connect the grounds on each side of the PCB. This reduces the high-
frequency impedance of the grounding and maximizes the filter's performance.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
p
Chip EMIFILr
0.8
0.8
Reflow Soldering
NFM18C/NFM18PC/NFL18ST
• NFp18, NFM55P are specially adapted for reflow soldering.
• NFp21 is specially adapted for reflow soldering.
o Reflow Soldering
NFM21C/NFR21G
NFM21P/NFL21S
NFM3DC/NFM3DP
NFM31P
NFM41C/NFM41P
NFM21C/NFR21G
NFM21PC/NFL21S
Small diameter thru hole ø0.4
NFL18SP
Small diameter thru hole
a
c
d
Part Number
Small diameter thru hole
0.6
1.0
2.2
0.4
1.0
2.0
0.4
ø0.2-ø0.3
ø0.2-ø0.3
Chip mounting side
Soldering and Mounting
0.6
1.0
1.0
1.5
a
1.4
1.4
2.0
b
-
NFM3DC/NFM3DP/
NFM31P
NFM41C/NFM41P
1.4
2.5
2.5
3.5
c
Small diameter thru hole ø0.4
Size (mm)
a
b
c
d
2.6
4.4
4.4
6.0
d
Chip
0.05
0.8
1.0
1.2
1.2
e
NFM18PS
1.9
2.0
2.6
2.6
NFM55P
Small diameter thru hole
f
Small diameter thru hole
1.5
2.0
4.7
6.7
0.8
1.2
2.0
2.3
2.4
3.0
3.0
g
Please contact us if using
thinner land pad than 18 m.
ø1.0-ø2.0
o Flow Soldering
Part Number
ø0.2
NFM3DC
NFM3DP
NFM31P
NFM41C
NFM41P
Chip mounting side
1.0
1.0
1.5
a
1.4
1.4
2.0
b
Continued on the following page.
2.5
2.5
3.5
c
Size (mm)
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
Small diameter
thru hole ø0.4
4.4
4.4
6.0
d
a
b
d
c
1.0
1.2
1.2
e
2.0
2.6
2.6
f
(in mm)
2.4
3.0
3.0
g
139
Mar.28,2011
C31E.pdf