BLM18HG601SN1D Murata, BLM18HG601SN1D Datasheet - Page 93

• Manufacturer Part Number: BLM18HG601SN1D
• Description: EMI/RFI Suppressors & Ferrites 0603 600 OHM
• Manufacturer: Murata

Specifications of BLM18HG601SN1D

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 600 Ohms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 1 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0603 (1608 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 1ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0603
• Inductor Case Style: 0603
• No. Of Pins: 2
• Core Material: Ferrite
• Resistance: 1ohm
• Rohs Compliant: Yes
• Operating Temperature Min: -55°C
• Operating Temperature Max: +125°C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

BL
!Note
BLA2A
BLA31
1. Standard Land Pattern Dimensions
BLM02
BLM03
BLM15
(Except BLM
15_AN1 series)
BLM18
BLM21
BLM31
BLM41
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
p
Chip Ferrite Bead
oReflow and Flow
oReflow Soldering
BLM Series
And BLM02/03/15/18G is specially adapted for reflow
soldering.
Except BLM03PG/15AX·PD·PG/18PG·KG·SG/21PG.
BLM02
BLM03
BLM15
BLM18
BLM21
Type
BLA2A
(except 18G)
Soldering
Reflow
Reflow
Reflow
Reflow
Reflow
Flow/
Flow
0.5 Pitch
a
b
0.16-0.2
1.75
0.2-0.3
0.4
0.7
1.2
a
0.25
Soldering and Mounting
0.4-0.56
0.6-0.9
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
b
• If there are high amounts of self-heating on pattern, the
contact points of PCB and part may become damaged.
0.2-0.23
0.3
0.5
0.7
1.0
c
oReflow and Flow
BLM03AX
BLM03PG
BLM15AX
BLM15Pp
BLM18PG
BLM18KG
BLM18SG
BLM21PG
BLM31PG
BLM41PG
Do not apply narrower pattern than listed above to
BLMppAX/P/K/S.
Narrow pattern can cause excessive heat or open circuit.
BLMppAX/P/K/S
Type
1.5max.
2.2max.
BLA31
0.5-1.5
1.7-2.5
1max.
Current
1.5/2
1.5/2
Rated
3-4
1.5
(A)
6
2
3
6
3
6
3
6
Soldering
Reflow
Reflow
Reflow
0.8 Pitch
Flow/
2.8
0.2-0.3
0.4
0.7
1.2
2.0
3.0
a
a
b
0.4
3.0-4.0
4.2-5.2
5.5-6.5
0.6-0.9
1.2-1.4
2.2-2.6
Reflow
1.8-2.0
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
Flow
b
0.3
0.5
0.7
1.0
1.2
c
Land Pad Thickness
18 m 35 m 70 m
0.3
0.5
1.2
0.7
1.2
2.4
6.4
1.0
1.2
2.4
6.4
1.2
2.4
6.4
1.2
2.4
6.4
and Dimension d
0.3
0.5
0.7
0.7
0.7
1.2
3.3
1.0
1.0
1.2
3.3
1.2
1.2
3.3
1.2
1.2
3.3
1.65
1.65
1.65
1.65
0.3
0.5
0.5
0.7
0.7
0.7
1.0
1.0
1.0
1.2
1.2
1.2
1.2
(in mm)
91
Mar.28,2011
C31E.pdf