BLM21BD272SH1L Murata, BLM21BD272SH1L Datasheet - Page 67

• Manufacturer Part Number: BLM21BD272SH1L
• Description: EMI/RFI Suppressors & Ferrites 0805 2.7Kohms HiSpd Signal Line Tape
• Manufacturer: Murata
• Series: BLM Br

Specifications of BLM21BD272SH1L

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 2.7 KOhms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.8 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0805 (2012 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.8ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0805 / 2012
• Operating Temperature Max: +125°C
• Operating Temperature Min: -55°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Resin coating (DLW31S)
2. Resin coating (DLW43S)
Do not make any resin coating DLW31S series.
The impedance value may change due to high
cure-stress of resin to be used for coating/ molding
products.
An open circuit issue may occur by mechanical
stress caused by the resin, amount/ cured shape of
resin, or operating condition etc. Some resin
contains some impurities or chloride possible to
generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil,
leading to open circuit.
So, please pay your careful attention in selecting
resin in case of coating/ molding the products with
the resin.
The inductance value may change due to high
cure-stress of resin to be used for
coating/ molding products.
An open circuit issue may occur by mechanical
stress caused by the resin, amount/ cured shape of
resin, or operating condition etc. Some resin
contains some impurities or chloride possible to
generate chlorine by hydrolysis under some operating
condition may cause corrosion of wire of coil,
leading to open circuit.
Notice (Handling)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
3. Resin coating (Except DLW31S/43S)
4. Caution for use (DLW31S/43S)
So, please pay your careful attention in selecting
resin in case of coating/ molding the products with
the resin. Prior to use the coating resin,
please make sure no reliability issue is observed
by evaluating products mounted on your board.
It may affect the product's performance when using
resin for coating/ molding products, except
DLW31S/43S.
So please pay careful attention in selecting resin.
Prior to use, please evaluate reliability with the
product mounted in your application set.
Sharp material, such as a pair of tweezers,
should not touch the winding portion to prevent
breaking the wire.
Mechanical shock should not be applied to the
products mounted on the board to prevent breaking
the core.
Chip EMIFILr!Caution/Notice
C50E.pdf
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