BLM21BD272SH1L Murata, BLM21BD272SH1L Datasheet - Page 73

• Manufacturer Part Number: BLM21BD272SH1L
• Description: EMI/RFI Suppressors & Ferrites 0805 2.7Kohms HiSpd Signal Line Tape
• Manufacturer: Murata
• Series: BLM Br

Specifications of BLM21BD272SH1L

• Shielding: Unshielded
• Test Frequency: 100 MHz
• Product: Chip Ferrite Beads
• Impedance: 2.7 KOhms
• Tolerance: 25 %
• Maximum Dc Current: 200 mAmps
• Maximum Dc Resistance: 0.8 Ohms
• Operating Temperature Range: - 55 C to + 125 C
• Package / Case: 0805 (2012 metric)
• Termination Style: SMD/SMT
• Dc Resistance Max: 0.8ohm
• Dc Current Rating: 200mA
• Ferrite Mounting: SMD
• Ferrite Case Style: 0805 / 2012
• Operating Temperature Max: +125°C
• Operating Temperature Min: -55°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
(3) Reworking with Soldering Iron
4. Mounting on-board with Conductive Glue of BLM18AG_WH1
5. Cleaning
(1) Cleaning Temperature: 60 C max. (40 C max. for
(2) Ultrasonic
(3) Cleaning agent
The following conditions must be strictly followed when
using a soldering iron.
Pre-heating: 150 C 60s min.
Soldering iron power output: 30W max.
Temperature of soldering iron tip / Soldering time:
Do not allow the tip of the soldering iron to directly
contact the chip.
For additional methods of reworking with a soldering iron,
please contact Murata engineering.
Please adhere rigidly to the condition below which shows
the method of mounting with conductive glue.
Please coat print pads with conductive glue using
metal mask and metal squeegee, and then mount our
products on the substrates with a mount machine or
human hand.
Please put the substrates into a oven (140 to 150 C)
for 30 minutes in order to cure the adhesive.
Please check whether the chips and the substrates are
connected with the conductive glue or not and there is
no electrical short of the conductive glue.
Following conditions should be observed when cleaning
chip EMI filter.
alcohol type cleaner)
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
BLM/NFM21H/DLW31S/DLW43S
– 350 C max./3s max. (2 Times max.)
Chip EMIFILr (Soldering and Mounting)
(4) Ensure that flux residue is completely removed.
For additional cleaning methods, please contact Murata
engineering.
1. Board
2. Thickness of Glue
3. Recommended Conductive
Do not clean BLM18AGpppWH1/DLW31S/43S series.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
(b) Aqueous cleaning agent
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
Glue
Isopropyl alcohol (IPA)
Pine Alpha ST-100S
Print Pads
Board
Ceramic Board or Alumina Board
30 to 50 m
PC3000
(Manufactured by Heraeus)
Conductive Glue
C50E.pdf
71
08.8.28
4