PMF8118TP Ericsson Power Modules, PMF8118TP Datasheet - Page 2

• Manufacturer Part Number: PMF8118TP
• Description: DC/DC Converters & Regulators 0.8-1.8V 10A Non-Iso Input 12V 18W
• Manufacturer: Ericsson Power Modules
• Series: PMFr

Specifications of PMF8118TP

• Output Power: 18 W
• Input Voltage Range: 10.8 V to 13.2 V
• Number Of Outputs: 1
• Output Voltage (channel 1): 0.8 V to 1.8 V
• Output Current (channel 1): 10 A
• Package / Case Size: DIP
• Output Type: POLA Non-Isolated Regulator
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Prepared (also subject responsible if other)
Henrik Sundh (MPM/BY/P)
Approved
MPM/BY/M [Krister Lundberg]
PMF 8000 series
PMF 8000 series
PMF 8000 series
POL regulator, Input 10.8-13.2 V, Output 10 A/55 W
POL regulator, Input 10.8-13.2 V, Output 10 A/55 W
POL regulator, Input 10.8-13.2 V, Output 10 A/55 W
General Information
Ordering Information
See Contents for individual product ordering numbers.
Option
Through hole pin
SMD pin
SMD pin, leadfree reflow
temperature capable pin
Reliability
The Mean Time Between Failure (MTBF) is calculated at full
output power and an operating ambient temperature (T
+40°C. Different methods could be used to calculate the
predicted MTBF and failure rate which may give different
results. Ericsson Power Modules currently uses Telcordia
SR332.
Predicted MTBF for the series is:
-
Telcordia SR332 is a commonly used standard method
intended for reliability calculations in IT&T equipment. The
parts count procedure used in this method was originally
modelled on the methods from
MIL-HDBK-217F, Reliability Predictions of Electronic
Equipment.
It assumes that no reliability data is available on the actual
units and devices for which the predictions are to be made,
i.e. all predictions are based on generic reliability
parameters.
4.25 million hours according to Telcordia SR332, issue
1, Black box technique.
Suffix
P
S
R
PMF8518LP
PMF8518LS
PMF8518LSR
Checked
A
) of
PRODUCT SPECIFICATION
No.
1/1301 BMR 643 8 Uen
Date
2006-02-20
Compatibility with RoHS requirements)
The products are compatible with the relevant clauses and
requirements of the RoHS directive 2002/95/EC and have a
maximum concentration value of 0.1% by weight in
homogeneous materials for lead in other applications other
than lead in solder, lead in high melting temperature type
solder, lead in glass of electronics components, lead in
electronic ceramic parts and lead as an alloying element in
copper containing up to 4% lead by weight, mercury,
hexavalent chromium, PBB and PBDE and of 0.01% by
weight in homogeneous materials for cadmium.
Exemptions in the RoHS directive utilized in the products:
-
-
-
-
Quality Statement
The products are designed and manufactured in an
industrial environment where quality systems and methods
like ISO 9000, 6σ (sigma), and SPC are intensively in use to
boost the continuous improvements strategy. Infant
mortality or early failures in the products are screened out
and they are subjected to an ATE-based final test.
Conservative design rules, design reviews and product
qualifications, plus the high competence of an engaged
work force, contribute to the high quality of our products.
Warranty
Warranty period and conditions are defined in Ericsson
Power Modules General Terms and Conditions of Sale.
Limitation of Liability
Ericsson power Modules does not make any other
warranties, expressed or implied including any warranty of
merchantability or fitness for a particular purpose
(including, but not limited to, use in life support
applications, where malfunctions of product can cause
injury to a person’s health or life).
Lead as an alloying element in copper alloy containing
up to 4% lead by weight (used in connection pins
made of Brass)
Lead in high melting temperature type solder (used to
solder the die in semiconductor packages)
Lead in glass of electronics components and in
electronic ceramic parts (e.g. fill material in chip
resistors)
Lead in solder for servers, storage and storage array
systems, network infrastructure equipment for
switching, signalling, transmission as well as network
management for telecommunication
(Note: the products are manufactured in lead-free
soldering processes and the lead present is only
located in the terminal plating finishes on some
components)
Technical Specifi cation
Technical Specifi cation
Technical Specifi cation
EN/LZT 146 318 R1B February 2006
EN/LZT 146 318 R1B April 2006
EN/LZT 146 318 R1C Sep 2006
© Ericsson Power Modules AB
© Ericsson Power Modules AB
© Ericsson Power Modules AB
Rev
A
Reference
2 (3)
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