HSP061-8M16 STMicroelectronics, HSP061-8M16 Datasheet - Page 7

• Manufacturer Part Number: HSP061-8M16
• Description: TVS DIODE 3V 8CH BI 16UQFN
• Manufacturer: STMicroelectronics

Specifications of HSP061-8M16

• Mounting Type: Surface Mount
• Voltage - Reverse Standoff (typ): 3V
• Voltage - Breakdown: 6V
• Polarization: 8 Channel Array - Bidirectional
• Package / Case: 16-UFQFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power (watts): -
• Lead Free Status / Rohs Status: Details
• Other names: 497-11044-2

HSP061-8M16
4
4.1
4.2
Recommendation on PCB assembly
Figure 12. Recommended stencil window position
Solder paste
1.
2.
3.
4.
Placement
1.
2.
3.
4.
5.
6.
Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste recommended.
Offers a high tack force to resist component displacement during PCB movement.
Use solder paste with fine particles: powder particle size 20-45 µm.
Manual positioning is not recommended.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering.
Standard tolerance of ± 0.05 mm is recommended.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
400 µm
400 µm
4 µm
192 µm
200 µm
2800 µm
2000 µm
Doc ID 18055 Rev 1
4 µm
14 µm
14
400 µm
µm
60 µm
60 µm
Recommendation on PCB assembly
Footprint
Stencil window
Footprint
T=100 µm
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